component

STPS2H100AY

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STMicroelectronics Schottky Barrier Diodes (SBD), SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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STPS2H100AY

STMicroelectronics · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)

STPS2H100AY from STMicroelectronics, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky rectifier; VRRM 100 V, IF(AV) 2 A at TL = 130 °C, δ = 0.5.
2 A passive Anode of the Schottky rectifier; forward voltage max 0.65 V at IF = 2 A, Tj = 125 °C.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current IR 1 µA Tj = 25 °C, VR = VRRM 2
Reverse leakage current IR 0.4 1 mA Tj = 125 °C, VR = VRRM 2
Forward voltage drop VF 0.79 V Tj = 25 °C, IF = 2 A 2
Forward voltage drop VF 0.6 0.65 V Tj = 125 °C, IF = 2 A 2
Forward voltage drop VF 0.88 V Tj = 25 °C, IF = 4 A 2
Forward voltage drop VF 0.69 0.74 V Tj = 125 °C, IF = 4 A 2
Repetitive peak reverse voltage VRRM 100 V 2
Average forward current IF(AV) 2 A SMA / SMB, TL = 130 °C, δ = 0.5 2
Surge non repetitive forward current IFSM 75 A tp = 10 ms sinusoidal 2
Repetitive peak avalanche power PARM 2400 W tp = 1 µs, Tj = 25 °C 2
Storage temperature range Tstg -65 175 °C 2
Operating junction temperature range Tj -40 175 °C condition to avoid thermal runaway for a diode on its own heatsink 2
Junction to lead thermal resistance Rth(j-l) 30 °C/W SMA 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 5

CAD (KiCad official)

  • Symbol: STPS2H100AY
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: stps2h100ay-etched.step / stps2h100ay-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stps2h100ay.step / stps2h100ay.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (9 pp, sha256 bf42331815d38cb4, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF