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STPS2170AF

STMicroelectronics · Schottky Diodes · SMA

STPS2170AF from STMicroelectronics, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 170 V 2
Repetitive peak reverse voltage, Tj = -40 °C VRRM 160 V Tj = -40 °C 2
Forward rms current IF(RMS) 15 A 2
Average forward current IF(AV) 2 A δ = 0.5, square wave; SMA Flat, SMA Flat Notch TL = 145 °C 2
Surge non repetitive forward current IFSM 70 A SMA Flat, SMA Flat Notch tp = 10 ms sinusoidal 2
Repetitive peak avalanche power PARM 165 W tp = 10 µs, Tj = 125 °C 2
Storage temperature range Tstg -65 175 °C 2
Maximum operating junction temperature Tj 175 °C 2
Junction to lead thermal resistance Rth(j-l) 20 °C/W SMA Flat, SMA Flat Notch 2
Reverse leakage current, Tj = 25 °C IR 2.8 µA Tj = 25 °C, VR = VRRM 2
Reverse leakage current, Tj = 125 °C IR 0.5 2.8 mA Tj = 125 °C, VR = VRRM 2
Forward voltage drop, Tj = 25 °C VF 0.82 V Tj = 25 °C, IF = 2 A; pulse tp = 380 µs, δ < 2% 2
Forward voltage drop, Tj = 125 °C VF 0.62 0.67 V Tj = 125 °C, IF = 2 A; pulse tp = 380 µs, δ < 2% 2
Forward voltage drop, Tj = 25 °C VF 0.89 V Tj = 25 °C, IF = 4 A; pulse tp = 380 µs, δ < 2% 2
Forward voltage drop, Tj = 125 °C VF 0.7 0.75 V Tj = 125 °C, IF = 4 A; pulse tp = 380 µs, δ < 2% 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA 4

CAD (KiCad official)

  • Symbol: STPS2170AF
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: stps2170af-etched.step / stps2170af-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stps2170af.step / stps2170af.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (12 pp, sha256 e21c04da013f5ab0, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF