# STPS1L30U

**STMicroelectronics** · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

STPS1L30U from STMicroelectronics, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SMB(DO-214AA) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse leakage current | IR |  |  | 200 | µA | Tj = 25°C, VR = VRRM | 2 |
| Reverse leakage current | IR |  | 6 | 15 | mA | Tj = 100°C, VR = VRRM | 2 |
| Forward voltage drop | VF |  |  | 0.395 | V | Tj = 25°C, IF = 1A | 2 |
| Forward voltage drop | VF |  | 0.26 | 0.3 | V | Tj = 125°C, IF = 1A | 2 |
| Forward voltage drop | VF |  |  | 0.445 | V | Tj = 25°C, IF = 2A | 2 |
| Forward voltage drop | VF |  | 0.325 | 0.375 | V | Tj = 125°C, IF = 2A | 2 |
| Repetitive peak reverse voltage | VRRM |  |  | 30 | V |  | 1 |
| RMS forward voltage (as printed) | IF(RMS) |  |  | 10 | A |  | 1 |
| Average forward current | IF(AV) |  |  | 1 | A | TL = 135°C δ = 0.5 | 1 |
| Surge non repetitive forward current | IFSM |  |  | 75 | A | tp = 10ms sinusoidal | 1 |
| Repetitive peak reverse current | IRRM |  |  | 1 | A | tp = 2µs F = 1kHz square | 1 |
| Non repetitive peak reverse current | IRSM |  |  | 1 | A | tp = 100µs square | 1 |
| Repetitive peak avalanche power | PARM |  |  | 1500 | W | tp = 1µs Tj = 25°C | 1 |
| Storage temperature range | Tstg | -65 |  | 150 | °C |  | 1 |
| Maximum operating junction temperature | Tj |  |  | 150 | °C |  | 1 |
| Critical rate of rise of reverse voltage | dV/dt |  |  | 10000 | V/µs |  | 1 |
| Junction to lead thermal resistance (SMB) | Rth(j-l) |  |  | 25 | °C/W | SMB | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | lead (Epoxy printed circuit board FR4, copper | 4 |

## CAD (KiCad official)

- Symbol: `STPS1L30U`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `stps1l30u-etched.step` / `stps1l30u-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `stps1l30u.step` / `stps1l30u.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [STMicroelectronics datasheet](docs/stps1l30u-datasheet.pdf) (7 pp, sha256 `346ef3e347c154dd`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/stps1l30u-datasheet.pdf)