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STPS1L30A

STMicroelectronics · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)

STPS1L30A from STMicroelectronics, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current (Tj = 25°C) IR 200 µA Pulse test: tp = 380 µs, δ < 2%; VR = VRRM; Tj = 25°C 2
Reverse leakage current (Tj = 100°C) IR 6 15 mA Pulse test: tp = 380 µs, δ < 2%; VR = VRRM; Tj = 100°C 2
Forward voltage drop (Tj = 25°C, IF = 1A) VF 0.395 V Pulse test: tp = 380 µs, δ < 2%; IF = 1A; Tj = 25°C 2
Forward voltage drop (Tj = 125°C, IF = 1A) VF 0.26 0.3 V Pulse test: tp = 380 µs, δ < 2%; IF = 1A; Tj = 125°C 2
Forward voltage drop (Tj = 25°C, IF = 2A) VF 0.445 V Pulse test: tp = 380 µs, δ < 2%; IF = 2A; Tj = 25°C 2
Forward voltage drop (Tj = 125°C, IF = 2A) VF 0.325 0.375 V Pulse test: tp = 380 µs, δ < 2%; IF = 2A; Tj = 125°C 2
Repetitive peak reverse voltage VRRM 30 V 1
RMS forward voltage IF(RMS) 10 A 1
Average forward current IF(AV) 1 A TL = 135°C, δ = 0.5 1
Surge non repetitive forward current IFSM 75 A tp = 10ms sinusoidal 1
Repetitive peak reverse current IRRM 1 A tp = 2µs, F = 1kHz square 1
Non repetitive peak reverse current IRSM 1 A tp = 100µs square 1
Repetitive peak avalanche power PARM 1500 W tp = 1µs, Tj = 25°C 1
Storage temperature range Tstg -65 150 °C 1
Maximum operating junction temperature Tj 150 °C Thermal runaway condition for a diode on its own heatsink (footnote *) 1
Critical rate of rise of reverse voltage dV/dt 10000 V/µs 1
Thermal resistance junction to lead (SMA) Rth(j-l) 30 °C/W Junction to lead, SMA package 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper lead (Epoxy printed circuit board FR4, copper 4

CAD (KiCad official)

  • Symbol: STPS1L30A
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: stps1l30a-etched.step / stps1l30a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stps1l30a.step / stps1l30a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (7 pp, sha256 346ef3e347c154dd, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF