component

STPS160U

Public Made by Adom

by adom

STMicroelectronics Schottky Barrier Diodes (SBD), SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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STPS160U

STMicroelectronics · Schottky Barrier Diodes (SBD) · SMB

STPS160U from STMicroelectronics, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 60 V 2
Average forward current IF(AV) 1 A TL = 130 °C, δ = 0.5 2
Surge non repetitive forward current IFSM 75 A tp = 10 ms sinusoidal 2
Repetitive peak reverse current IRRM 1 A tp = 2 µs, F = 1 kHz square 2
Non repetitive peak reverse current IRSM 1 A tp = 100 µs square 2
Repetitive peak avalanche power PARM 2400 W tp = 1 µs, Tj = 25 °C 2
Maximum operating junction temperature Tj 150 °C Condition to avoid thermal runaway for a diode on its own heatsink 2
Storage temperature range Tstg -65 150 °C 2
Critical rate of rise of reverse voltage dV/dt 10000 V/µs 2
Reverse leakage current IR 4 µA Tj = 25 °C, VR = VRRM, tp = 5 ms, δ < 2% 2
Reverse leakage current IR 1.1 4 mA Tj = 125 °C, VR = VRRM, tp = 5 ms, δ < 2% 2
Forward voltage drop VF 0.67 V Tj = 25 °C, IF = 1 A, tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.49 0.57 V Tj = 125 °C, IF = 1 A, tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.8 V Tj = 25 °C, IF = 2 A, tp = 380 µs, δ < 2% 2
Forward voltage drop VF 0.58 0.65 V Tj = 125 °C, IF = 2 A, tp = 380 µs, δ < 2% 2
Junction to lead thermal resistance (SMB) Rth(j-l) 23 °C/W SMB package 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) 5

CAD (KiCad official)

  • Symbol: STPS160U
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: stps160u-etched.step / stps160u-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stps160u.step / stps160u.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (9 pp, sha256 65f3885357db1149, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF