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STPS1150AY

STMicroelectronics · Schottky Barrier Diodes (SBD) · DO-214AC

STPS1150AY from STMicroelectronics, in a DO-214AC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky diode, marked by the band on the SMA package; the device is rated 150 V VRRM.
2 A passive Anode of the Schottky diode; the device is rated for 1 A average forward current (IF(AV)).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package DO-214AC
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 150 V Tj = -40 °C to +175 °C 2
Forward rms current IF(RMS) 15 A 2
Average forward current IF(AV) 1 A TL = 150 °C, δ = 0.5 square wave 2
Surge non repetitive forward current IFSM 50 A tp = 10 ms sinusoidal 2
Repetitive peak avalanche power PARM 108 W tp = 10 µs, Tj = 125 °C 2
Storage temperature range Tstg -65 175 °C 2
Operating junction temperature range Tj -40 175 °C 2
Junction to lead thermal resistance Rth(j-l) 30 °C/W 2
Reverse leakage current IR 0.2 1 µA Tj = 25 °C, VR = VRRM, tp = 5 ms, δ < 2% 2
Reverse leakage current IR 0.2 1 mA Tj = 125 °C, VR = VRRM, tp = 5 ms, δ < 2% 2
Forward voltage drop VF 0.78 0.82 V Tj = 25 °C, IF = 1 A, tp = 380 μs, δ < 2% 2
Forward voltage drop VF 0.62 0.67 V Tj = 125 °C, IF = 1 A, tp = 380 μs, δ < 2% 2
Forward voltage drop VF 0.85 0.89 V Tj = 25 °C, IF = 2 A, tp = 380 μs, δ < 2% 2
Forward voltage drop VF 0.69 0.75 V Tj = 125 °C, IF = 2 A, tp = 380 μs, δ < 2% 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper copper surface under each lead (SMA) 4

CAD (KiCad official)

  • Symbol: STPS1150AY
  • Footprint: Diode_SMD:D_SMA
  • 3D model: DO-214AC (KiCad packages3D, STEP)
  • 3D model files: stps1150ay-etched.step / stps1150ay-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stps1150ay.step / stps1150ay.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (9 pp, sha256 18c80f9965ada6e2, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF