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Contents

README

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STP26NM60N

STMicroelectronics · MOSFETs · TO-220

STP26NM60N from STMicroelectronics, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal: control input with ±30 V absolute maximum gate-source voltage and 2-4 V gate threshold voltage for switching control.
2 D passive Drain terminal: 600 V maximum drain-source voltage, 20 A continuous current at TC=25°C (12.6 A at TC=100°C), with 80 A pulsed rating and 135 mΩ typical on-resistance at VGS=10V.
3 S power_in Source terminal: reference electrode for gate-source voltage and return path for drain current through drain-source channel and body diode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package TO-220
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 600 V 2
Gate-source voltage VGS -30 30 V 2
Drain current (continuous) at TC = 25 °C ID 20 A TC = 25 °C 2
Drain current (continuous) at TC = 100 °C ID 12.6 A TC = 100 °C 2
Drain current (pulsed) IDM 80 A Pulse width limited by safe operating area 2
Total power dissipation PTOT 140 W TC = 25 °C 2
Peak diode recovery voltage slope dv/dt 15 V/ns ISD ≤ 20 A, di/dt ≤ 400 A/μs, VDS(peak) ≤ V(BR)DSS, VDD = 480 V 2
Storage temperature range Tstg -55 150 °C 2
Avalanche current, repetitive or not-repetitive IAR 6 A Pulse width limited by TJ max. 2
Single pulse avalanche energy EAS 610 mJ Starting TJ = 25 °C, ID = IAR, VDD = 50 V 2
Thermal resistance, junction-to-case RthJC 0.89 °C/W 2
Thermal resistance, junction-to-ambient (TO-220) RthJA 62.5 °C/W 2
Drain-source breakdown voltage V(BR)DSS 600 V ID = 1 mA, VGS = 0 V 3
Zero gate voltage drain current IDSS 1 µA VGS = 0 V, VDS = 600 V 3
Zero gate voltage drain current at TC = 125 °C IDSS 100 µA VGS = 0 V, VDS = 600 V, TC = 125 °C (specified by design, not tested in production) 3
Gate body leakage current IGSS -100 100 nA VDS = 0 V, VGS = ±30 V 3
Gate threshold voltage VGS(th) 2 3 4 V VDS = VGS, ID = 250 µA 3
Static drain-source on resistance RDS(on) 135 165 mΩ VGS = 10 V, ID = 10 A 3
Source-drain current ISD 20 A 4
Source-drain current (pulsed) ISDM 80 A Pulse width limited by safe operating area 4
Forward on voltage VSD 1.5 V ISD = 20 A, VGS = 0 V (pulsed: pulse duration = 300 μs, duty cycle 1.5%) 4

CAD (KiCad official)

  • Symbol: STP26NM60N
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: stp26nm60n-etched.step / stp26nm60n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stp26nm60n.step / stp26nm60n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (16 pp, sha256 3ba6c1bea249b8fd, retrieved 2026-09-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF