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STM32WB55CGU6

STMicroelectronics · Microcontrollers (MCU/MPU/SOC) · UFQFPN-48(7x7)

STM32WB55CGU6 from STMicroelectronics, in a UFQFPN-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model, then checked against ST open pin data); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup-domain supply for the RTC, LSE and backup registers, specified from 1.55 to 3.6 V (VBAT backup operating voltage).
2 PC14-OSC32_IN bidirectional Supplied through the power switch, which sinks only 3 mA, so output speed must not exceed 2 MHz with a 30 pF load and it must not drive current sources; alternate function OSC32_IN for the LSE crystal.
3 PC15-OSC32_OUT bidirectional Supplied through the power switch, which sinks only 3 mA, so output speed must not exceed 2 MHz with a 30 pF load and it must not drive current sources; alternate function OSC32_OUT for the LSE crystal.
4 PH3-BOOT0 bidirectional 5 V-tolerant FT I/O multiplexed with the BOOT0 boot-mode function and with LSCO clock output (alternate function CM4_EVENTOUT, LSCO).
5 PB8 bidirectional 5 V-tolerant FT_fl I/O (Fm+ capable, LCD function supplied by VLCD) with alternate functions TIM1_CH2N, SAI1_PDM_CK1, I2C1_SCL, QUADSPI_BK1_IO1, LCD_SEG16, SAI1_MCLK_A and TIM16_CH1.
6 PB9 bidirectional 5 V-tolerant FT_fla I/O (Fm+ capable, LCD and analog switch functions) with alternate functions TIM1_CH3N, I2C1_SDA, SPI2_NSS, IR_OUT, QUADSPI_BK1_IO0 and TIM17_CH1.
7 NRST bidirectional Bidirectional reset pin with weak pull-up resistor (RST structure).
8 VDDA power_in Analog supply for the ADC, comparators and voltage reference buffer, 1.62 to 3.6 V when ADC or COMP is used; on UFQFPN48 it is connected to VREF+.
9 PA0 bidirectional 5 V-tolerant FT_a I/O with analog switch function supplied by VDDA; alternate functions include TIM2_CH1, COMP1_OUT, SAI1_EXTCLK and TIM2_ETR, and additional functions COMP1_INM, ADC1_IN5 and RTC_TAMP2/WKUP1.
10 PA1 bidirectional 5 V-tolerant FT_la I/O with analog switch function supplied by VDDA; alternate functions include TIM2_CH2, I2C1_SMBA, SPI1_SCK and LCD_SEG0, and additional functions COMP1_INP and ADC1_IN6.
11 PA2 bidirectional 5 V-tolerant FT_la I/O with analog switch function supplied by VDDA; alternate functions include LSCO clock output, TIM2_CH3, LPUART1_TX and QUADSPI_BK1_NCS, and additional functions COMP2_INM, ADC1_IN7 and WKUP4.
12 PA3 bidirectional 5 V-tolerant FT_la I/O with analog switch function supplied by VDDA; alternate functions include TIM2_CH4, SAI1_PDM_CK1, LPUART1_RX and QUADSPI_CLK, and additional functions COMP2_INP and ADC1_IN8.
13 PA4 bidirectional 5 V-tolerant FT_a I/O with analog switch function supplied by VDDA; alternate functions include SPI1_NSS, SAI1_FS_B and LPTIM2_OUT, and additional functions COMP1_INM, COMP2_INM and ADC1_IN9.
14 PA5 bidirectional 5 V-tolerant FT_a I/O with analog switch function supplied by VDDA; alternate functions include TIM2_CH1, TIM2_ETR, SPI1_SCK and LPTIM2_ETR, and additional functions COMP1_INM, COMP2_INM and ADC1_IN10.
15 PA6 bidirectional 5 V-tolerant FT_la I/O; alternate functions include TIM1_BKIN, SPI1_MISO, LPUART1_CTS, QUADSPI_BK1_IO3 and TIM16_CH1, and additional function ADC1_IN11.
16 PA7 bidirectional 5 V-tolerant FT_fla I/O (Fm+ capable, analog switch function supplied by VDDA); alternate functions include TIM1_CH1N, I2C3_SCL, SPI1_MOSI, QUADSPI_BK1_IO2 and TIM17_CH1, and additional function ADC1_IN12.
17 PA8 bidirectional 5 V-tolerant FT_la I/O; alternate functions include MCO clock output, TIM1_CH1, USART1_CK, SAI1_SCK_A and LPTIM2_OUT, and additional function ADC1_IN15.
18 PA9 bidirectional 5 V-tolerant FT_fla I/O (Fm+ capable, analog switch function supplied by VDDA); alternate functions include TIM1_CH2, I2C1_SCL, SPI2_SCK, USART1_TX and SAI1_FS_A, and additional functions COMP1_INM and ADC1_IN16.
19 PB2 bidirectional 5 V-tolerant FT_a I/O with analog switch function supplied by VDDA; alternate functions include RTC_OUT, LPTIM1_OUT, I2C3_SMBA, SPI1_NSS and SAI1_EXTCLK, and additional function COMP1_INP.
20 VDD power_in Standard operating voltage supply of 1.71 to 3.6 V for I/Os, the internal regulator and system functions.
21 RF1 bidirectional RF input/output that must be connected to the antenna through a low-pass matching network, and that uses the nominal PCB layout.
22 VSSRF power_in RF ground that must be connected to GND.
23 VDDRF power_in Dedicated RF supply that must be connected to VDD, with minimum RF voltage of 1.71 V.
24 OSC_OUT output 32 MHz main oscillator output, also used as HSE source; use the nominal PCB layout according to the reference design (AN5165).
25 OSC_IN input 32 MHz main oscillator input, also used as HSE source; use the nominal PCB layout according to the reference design (AN5165).
26 AT0 output Reserved pin that must be kept unconnected.
27 AT1 output Reserved pin that must be kept unconnected.
28 PB0 bidirectional 3.6 V-tolerant TT I/O with alternate functions COMP1_OUT, CM4_EVENTOUT and RF_TX_MOD_EXT_PA; injected current limited to -5/0 mA and high output frequency may impact RF performance.
29 PB1 bidirectional 3.6 V-tolerant TT I/O with alternate functions LPUART1_RTS_DE, LPTIM2_IN1 and CM4_EVENTOUT; injected current limited to -5/0 mA and high output frequency may impact RF performance.
30 PE4 bidirectional 5 V-tolerant FT I/O with alternate function CM4_EVENTOUT.
31 VFBSMPS power_in SMPS feedback voltage input, 1.4 to 3.6 V.
32 VSSSMPS power_in Ground for the SMPS step-down converter that must be connected to GND.
33 VLXSMPS power_out SMPS switching node connected to the external inductor L1 (2.2 uH for 8 MHz or 10 uH for 4 MHz operation).
34 VDDSMPS power_in SMPS supply that must always be connected to VDD, from 1.71 to 3.6 V.
35 VDD power_in Standard operating voltage supply of 1.71 to 3.6 V for I/Os, the internal regulator and system functions.
36 PA10 bidirectional 5 V-tolerant FT_fl I/O (Fm+ capable, LCD function supplied by VLCD); alternate functions include TIM1_CH3, I2C1_SDA, USART1_RX, USB_CRS_SYNC and SAI1_SD_A.
37 PA11 bidirectional 5 V-tolerant FT_u I/O with USB function supplied by VDDB, alternate functions TIM1_CH4, SPI1_MISO, USART1_CTS and USB_DM.
38 PA12 bidirectional 5 V-tolerant FT_u I/O with USB function supplied by VDDUSB; alternate functions include TIM1_ETR, SPI1_MOSI, LPUART1_RX, USART1_RTS_DE and USB_DP.
39 PA13 bidirectional 5 V-tolerant FT_u I/O that after reset is configured as the JTMS-SWDIO debug function, with internal pull-up activated.
40 VDDUSB power_in USB transceiver supply of 3.0 to 3.6 V when USB is used; must be connected to VDD when not used.
41 PA14 bidirectional 5 V-tolerant FT_l I/O that after reset is configured as the JTCK-SWCLK debug function, with internal pull-down activated.
42 PA15 (JTDI) bidirectional 5 V-tolerant FT_l I/O that after reset is configured as the JTDI debug function, with internal pull-up activated; alternate functions include TIM2_CH1, SPI1_NSS and MCO.
43 PB3 (JTDO) bidirectional 5 V-tolerant FT_la I/O with analog switch function supplied by VDDA; alternate functions include JTDO-TRACESWO, TIM2_CH2, SPI1_SCK and USART1_RTS_DE, and additional function COMP2_INM.
44 PB4 (NJTRST) bidirectional 5 V-tolerant FT_fla I/O that after reset is configured as the NJTRST debug function, with internal pull-up activated; alternate functions include I2C3_SDA, SPI1_MISO and USART1_CTS.
45 PB5 bidirectional 5 V-tolerant FT_l I/O (LCD function supplied by VLCD); alternate functions include LPTIM1_IN1, I2C1_SMBA, SPI1_MOSI, USART1_CK and LPUART1_TX.
46 PB6 bidirectional 5 V-tolerant FT_fla I/O (Fm+ capable, analog switch function supplied by VDDA); alternate functions include LPTIM1_ETR, I2C1_SCL, USART1_TX and MCO, and additional function COMP2_INP.
47 PB7 bidirectional 5 V-tolerant FT_fla I/O (Fm+ capable, analog switch function supplied by VDDA); alternate functions include LPTIM1_IN2, TIM1_BKIN, I2C1_SDA and USART1_RX, and additional functions COMP2_INM and PVD_IN.
48 VDD power_in Standard operating voltage supply of 1.71 to 3.6 V for I/Os, the internal regulator and system functions.
49 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package UFQFPN-48(7x7)
Category Embedded Processors & Controllers
Pins 49

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
External main supply voltage VDDX - VSS -0.3 4 V Including VDD, VDDA, VDDUSB, VLCD, VDDRF, VDDSMPS, VBAT, VREF+ 85
Input voltage on TT_xx pins VIN 4 V Input voltage on TT_xx pins 85
Input voltage on any other pin VIN 4 V Input voltage on any other pin 85
Variations between different VDDX power pins /ΔVDDx/ 50 mV Variations between different VDDX power pins of the same domain 85
Variations between all the different ground pins /VSSx-VSS/ 50 mV Variations between all ground pins, include VREF- 85
Allowed voltage difference for VREF+ > VDDA VREF+ - VDDA 0.4 V VREF+ > VDDA 85
Total current into sum of all VDD power lines (source) ∑IVDD 130 mA 85
Total current out of sum of all VSS ground lines (sink) ∑IVSS 130 mA 85
Maximum current into each VDD power pin (source) IVDD(PIN) 100 mA 85
Maximum current out of each VSS ground pin (sink) IVSS(PIN) 100 mA 85
Output current sunk by any I/O and control pin except FT_f IIO(PIN) 20 mA Sunk, any I/O and control pin except FT_f 85
Output current sunk by any FT_f pin IIO(PIN) 20 mA Sunk, any FT_f pin 85
Output current sourced by any I/O and control pin IIO(PIN) 20 mA Sourced, any I/O and control pin 85
Total output current sunk by sum of all I/Os and control pins ∑IIO(PIN) 100 mA Sunk, sum of all I/Os and control pins 85
Total output current sourced by sum of all I/Os and control pins ∑IIO(PIN) 100 mA Sourced, sum of all I/Os and control pins 85
Injected current on FT_xxx, TT_xx, RST and B pins IINJ(PIN) -5 0 mA Except PB0 and PB1 85
Injected current on PB0 and PB1 IINJ(PIN) -5 0 mA PB0 and PB1 85
Total injected current (sum of all I/Os and control pins) ∑/IINJ(PIN)/ 25 mA Sum of all I/Os and control pins 85
Storage temperature range TSTG -65 150 °C 86
Maximum junction temperature TJ 130 °C 86
Internal AHB clock frequency fHCLK 0 64 MHz 87
Internal APB1 clock frequency fPCLK1 0 64 MHz 87
Internal APB2 clock frequency fPCLK2 0 64 MHz 87
Standard operating voltage VDD 1.71 3.6 V Standard operating voltage 87
Analog supply voltage VDDA 1.62 3.6 V ADC or COMP used 87
Analog supply voltage VDDA 2.4 3.6 V VREFBUF used 87
Analog supply voltage VDDA 0 V ADC, COMP, VREFBUF not used 87
Backup operating voltage VBAT 1.55 3.6 V 87
SMPS feedback voltage VFBSMPS 1.4 3.6 V 88
Minimum RF voltage VDDRF 1.71 3.6 V 88
USB supply voltage VDDUSB 3 3.6 V USB used 88
USB supply voltage VDDUSB 0 3.6 V USB not used 88
I/O input voltage VIN -0.3 V TT_xx I/O; max VDD + 0.3 88
Power dissipation UFQFPN48 PD 803 mW TA = 85 °C for suffix 6 88
Ambient temperature for the suffix 6 version TA -40 85 °C Maximum power dissipation 88
Ambient temperature for the suffix 6 version TA 105 °C Low-power dissipation 88
Junction temperature range TJ -40 105 °C Suffix 6 version 88
Frequency operating range (BLE) Fop 2402 2480 MHz 88
Frequency operating range (802.15.4) Fop 2405 2480 MHz 93
Internal reference voltage VREFINT 1.182 1.212 1.232 V -40 °C < TA < +125 °C 98
Internal reference voltage spread over the temperature range ΔVREFINT 5 7.5 mV VDD = 3 V 98
Temperature coefficient TCoeff 30 50 ppm/°C -40 °C < TA < +125 °C 98
Long term stability ACoeff 300 1000 ppm 1000 hours, T = 25 °C 98
Voltage coefficient VDDCoeff 250 1200 ppm/V 3.0 V < VDD < 3.6 V 98
1/4 reference voltage VREFINT_DIV1 24 25 26 % % of VREFINT 98
1/2 reference voltage VREFINT_DIV2 49 50 51 % % of VREFINT 98
3/4 reference voltage VREFINT_DIV3 74 75 76 % % of VREFINT 98
Brown-out reset threshold 0 (rising edge) VBOR0 1.62 1.66 1.7 V Rising edge 96
Brown-out reset threshold 0 (falling edge) VBOR0 1.6 1.64 1.69 V Falling edge 96
Brown-out reset threshold 1 (rising edge) VBOR1 2.06 2.1 2.14 V Rising edge 96
Brown-out reset threshold 1 (falling edge) VBOR1 1.96 2 2.04 V Falling edge 96
Brown-out reset threshold 2 (rising edge) VBOR2 2.26 2.31 2.35 V Rising edge 96
Brown-out reset threshold 2 (falling edge) VBOR2 2.16 2.2 2.24 V Falling edge 96
Brown-out reset threshold 3 (rising edge) VBOR3 2.56 2.61 2.66 V Rising edge 96
Brown-out reset threshold 3 (falling edge) VBOR3 2.47 2.52 2.57 V Falling edge 96
Supply current in Stop 2 mode, RTC disabled IDD(Stop 2) 1.85 4.17 µA VDD = 3.0 V, TA = 25 °C, LCD disabled, BLE disabled 105

CAD (KiCad official)

  • Symbol: STM32WB55CGU6
  • Footprint: Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
  • 3D model: UFQFPN-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: stm32wb55cgu6-etched.step / stm32wb55cgu6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stm32wb55cgu6.step / stm32wb55cgu6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (193 pp, sha256 7eddf71700b00f75, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF