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Contents

README

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STM32F303K8T6

STMicroelectronics · Microcontrollers (MCU/MPU/SOC) · LQFP-32(7x7)

STM32F303K8T6 from STMicroelectronics, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model, then checked against ST open pin data); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Main digital power supply, 2.0 to 3.6 V; decoupling capacitors (100 nF ceramic + 1 µF) required as close as possible to pin.
2 PF0/OSC_IN bidirectional 5 V-tolerant (FT) GPIO port F bit 0; AF6: TIM1_CH3N; additional function OSC_IN for HSE crystal oscillator (4-32 MHz); reset state: floating input.
3 PF1/OSC_OUT bidirectional 5 V-tolerant (FT) GPIO port F bit 1; additional function OSC_OUT for HSE crystal oscillator; reset state: floating input.
4 NRST bidirectional Bidirectional reset pin (RST type) with embedded weak pull-up resistor (25-55 kΩ typical 40 kΩ); active-low device reset input / internal reset output; filters pulses shorter than 100 ns.
5 VDDA/VREF+ power_in Analog power supply and ADC/DAC positive reference voltage, 2.0 to 3.6 V (minimum 2.4 V when OPAMP or DAC are used); must be ≥ VDD and must power on before or simultaneously with VDD.
6 PA0 bidirectional 3.3 V TTa GPIO PA0; AF: TIM2_CH1/TIM2_ETR, TSC_G1_IO1, USART2_CTS, EVENTOUT; additional: ADC1_IN1 (fast channel), RTC_TAMP2/WKUP1; reset state: floating input.
7 PA1 bidirectional 3.3 V TTa GPIO PA1; AF: TIM2_CH2, TSC_G1_IO2, USART2_RTS_DE, TIM15_CH1N, EVENTOUT; additional: ADC1_IN2 (fast channel), RTC_REFIN; reset state: floating input.
8 PA2 bidirectional 3.3 V TTa GPIO PA2; AF: TIM2_CH3, TSC_G1_IO3, USART2_TX, COMP2_OUT, TIM15_CH1, EVENTOUT; additional: ADC1_IN3 (fast channel), COMP2_INM; reset state: floating input.
9 PA3 bidirectional 3.3 V TTa GPIO PA3; AF: TIM2_CH4, TSC_G1_IO4, USART2_RX, TIM15_CH2, EVENTOUT; additional: ADC1_IN4 (fast channel); reset state: floating input.
10 PA4 bidirectional 3.3 V TTa GPIO PA4 (reduced TSC sensitivity; recommended as sampling-capacitor I/O); AF: TIM3_CH2, TSC_G2_IO1, SPI1_NSS, USART2_CK, EVENTOUT; additional: ADC2_IN1 (fast channel), DAC1_OUT1, COMP2/4/6_INM4.
11 PA5 bidirectional 3.3 V TTa GPIO PA5 (reduced TSC sensitivity; recommended as sampling-capacitor I/O); AF: TIM2_CH1/TIM2_ETR, TSC_G2_IO2, SPI1_SCK, EVENTOUT; additional: ADC2_IN2 (fast channel), DAC1_OUT2, OPAMP2_VINM.
12 PA6 bidirectional 3.3 V TTa GPIO PA6 (reduced TSC sensitivity; recommended as sampling-capacitor I/O); AF: TIM16_CH1, TIM3_CH1, TSC_G2_IO3, SPI1_MISO, TIM1_BKIN, EVENTOUT; additional: ADC2_IN3 (slow channel), DAC2_OUT1, OPAMP2_VOUT.
13 PA7 bidirectional 3.3 V TTa GPIO PA7; AF: TIM17_CH1, TIM3_CH2, TSC_G2_IO4, SPI1_MOSI, TIM1_CH1N, EVENTOUT; additional: ADC2_IN4 (fast channel), COMP2_INP, OPAMP2_VINP.
14 PB0 bidirectional 3.3 V TTa GPIO PB0; AF: TIM3_CH3, TSC_G3_IO2, TIM1_CH2N, EVENTOUT; additional: ADC1_IN11, COMP4_INP, OPAMP2_VINP; reset state: floating input.
15 PB1 bidirectional 3.3 V TTa GPIO PB1; AF: TIM3_CH4, TSC_G3_IO3, TIM1_CH3N, COMP4_OUT, EVENTOUT; additional: ADC1_IN12; reset state: floating input.
16 VSS power_in Digital ground reference; total current out of all VSS pins must not exceed 140 mA; must always be connected to external ground.
17 VDD power_in Main digital power supply, 2.0 to 3.6 V; decoupling capacitors required as close as possible to pin.
18 PA8 bidirectional 5 V-tolerant (FT) GPIO PA8; AF0: MCO (master clock output); AF6: TIM1_CH1; AF7: USART1_CK; AF15: EVENTOUT; reset state: floating input.
19 PA9 bidirectional 5 V-tolerant (FT) GPIO PA9; AF: TSC_G4_IO1, TIM1_CH2, USART1_TX, TIM15_BKIN, TIM2_CH3, EVENTOUT; reset state: floating input.
20 PA10 bidirectional 5 V-tolerant (FT) GPIO PA10; AF: TIM17_BKIN, TSC_G4_IO2, TIM1_CH3, USART1_RX, COMP6_OUT, TIM2_CH4, EVENTOUT; reset state: floating input.
21 PA11 bidirectional 5 V-tolerant (FT) GPIO PA11; AF: TIM1_CH1N, USART1_CTS, CAN_RX, TIM1_CH4, TIM1_BKIN2, EVENTOUT; reset state: floating input.
22 PA12 bidirectional 5 V-tolerant (FT) GPIO PA12; AF: TIM16_CH1, TIM1_CH2N, USART1_RTS_DE, COMP2_OUT, CAN_TX, TIM1_ETR, EVENTOUT; reset state: floating input.
23 PA13 bidirectional 5 V-tolerant (FT) GPIO PA13; default function JTMS/SWDAT (SWD data line); AF: TIM16_CH1N, TSC_G4_IO3, IR_OUT, USART3_CTS, EVENTOUT.
24 PA14 bidirectional 5 V-tolerant FM+ capable (FTf) GPIO PA14; default function JTCK/SWCLK (SWD clock); AF: TSC_G4_IO4, I2C1_SDA, TIM1_BKIN, USART2_TX, EVENTOUT.
25 PA15 bidirectional 5 V-tolerant FM+ capable (FTf) GPIO PA15; default function JTDI; AF: TIM2_CH1/TIM2_ETR, TSC_SYNC, I2C1_SCL, SPI1_NSS, USART2_RX, TIM1_BKIN, EVENTOUT.
26 PB3 bidirectional 5 V-tolerant (FT) GPIO PB3; default function JTDO/TRACESWO; AF: TIM2_CH2, TSC_G5_IO1, SPI1_SCK, USART2_TX, TIM3_ETR, EVENTOUT.
27 PB4 bidirectional 5 V-tolerant (FT) GPIO PB4; default function NJTRST; AF: TIM16_CH1, TIM3_CH1, TSC_G5_IO2, SPI1_MISO, USART2_RX, TIM17_BKIN, EVENTOUT.
28 PB5 bidirectional 5 V-tolerant (FT) GPIO PB5; AF: TIM16_BKIN, TIM3_CH2, I2C1_SMBA, SPI1_MOSI, USART2_CK, TIM17_CH1, EVENTOUT; reset state: floating input.
29 PB6 bidirectional 5 V-tolerant FM+ capable (FTf) GPIO PB6; AF: TIM16_CH1N, TSC_G5_IO3, I2C1_SCL, USART1_TX, EVENTOUT; supports I2C Fast-mode Plus (up to 1 Mbit/s) with 20 mA current sink.
30 PB7 bidirectional 5 V-tolerant FM+ capable (FTf) GPIO PB7; AF: TIM17_CH1N, TSC_G5_IO4, I2C1_SDA, USART1_RX, TIM3_CH4, EVENTOUT; reset state: floating input.
31 BOOT0 input Dedicated boot mode selection pin (B type); sampled at reset to select boot source (user Flash, system memory, or embedded SRAM); input voltage range 0 to 9 V; VIL max = VDD−0.3 V, VIH min = 0.2×VDD+0.95 V.
32 VSS power_in Digital ground reference; total current out of all VSS pins must not exceed 140 mA; must always be connected to external ground.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package LQFP-32(7x7)
Category Embedded Processors & Controllers
Pins 32

CAD (KiCad official)

  • Symbol: STM32F303K8T6
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: stm32f303k8t6-etched.step / stm32f303k8t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stm32f303k8t6.step / stm32f303k8t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (115 pp, sha256 dc1490452e89dccc, retrieved 2026-09-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF