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STM32F302C6T6

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STMicroelectronics Microcontrollers (MCU/MPU/SOC), LQFP-48(7x7). Pinout checked against ST's open pin data, KiCad symbol/footprint/3D.

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STM32F302C6T6

STMicroelectronics · Microcontrollers (MCU/MPU/SOC) · LQFP-48(7x7)

STM32F302C6T6 from STMicroelectronics, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model, then checked against ST open pin data); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup power supply for the RTC and backup registers (VBAT supply domain).
2 PC13 bidirectional TC standard 3.3 V I/O supplied through the power switch, which sinks only 3 mA, so output speed must not exceed 2 MHz at 30 pF and it must not drive current sources such as LEDs; additional functions are WKUP2, RTC_TAMP1, RTC_TS and RTC_OUT.
3 PC14 bidirectional TC standard 3.3 V I/O (OSC32_IN) supplied through the power switch limited to 3 mA, so output use is limited to 2 MHz at 30 pF and it must not act as a current source.
4 PC15 bidirectional TC standard 3.3 V I/O (OSC32_OUT) supplied through the power switch limited to 3 mA, so output use is limited to 2 MHz at 30 pF and it must not act as a current source.
5 PF0 input FTf 5 V tolerant input with I2C FM+ option, used as OSC_IN for the external oscillator; alternate functions include I2C2_SDA, SPI2_NSS/I2S2_WS and TIM1_CH3N.
6 PF1 output FTf 5 V tolerant I/O with I2C FM+ option, used as OSC_OUT for the external oscillator; alternate functions include I2C2_SCL and SPI2_SCK/I2S2_CK.
7 NRST bidirectional Device reset input and internal reset output, active low, with an embedded weak pull-up resistor.
8 VSSA/VREF- power_in Analog ground and negative reference voltage for the analog peripherals.
9 VDDA/VREF+ power_in Analog power supply and positive reference voltage; analog supply range is 2.0 to 3.6 V per the features list.
10 PA0 bidirectional TTa 3.3 V tolerant I/O, ADC1_IN1 fast ADC channel and WKUP1 wakeup; alternate functions include TIM2_CH1/TIM2_ETR, TSC_G1_IO1, USART2_CTS and EVENTOUT, with RTC_TAMP2 as an additional function.
11 PA1 bidirectional TTa 3.3 V tolerant I/O with ADC1_IN2; alternate functions include RTC_REFIN, TIM2_CH2, TSC_G1_IO2, USART2_RTS_DE, TIM15_CH1N and EVENTOUT.
12 PA2 bidirectional TTa 3.3 V tolerant fast ADC I/O with ADC1_IN3 and COMP2_INM; alternate functions include TIM2_CH3, TSC_G1_IO3, USART2_TX, COMP2_OUT, TIM15_CH1 and EVENTOUT.
13 PA3 bidirectional TTa 3.3 V tolerant I/O with ADC1_IN4; alternate functions include TIM2_CH4, TSC_G1_IO4, USART2_RX, TIM15_CH2 and EVENTOUT.
14 PA4 bidirectional TTa 3.3 V tolerant I/O with reduced touch sensing sensitivity, recommended for use as a sampling capacitor I/O; additional functions include ADC1_IN5, DAC1_OUT1, COMP2_INM, COMP4_INM and COMP6_INM.
15 PA5 bidirectional TTa 3.3 V tolerant I/O; alternate functions include TIM2_CH1/TIM2_ETR, TSC_G2_IO2 and EVENTOUT, with OPAMP2_VINM as an additional function.
16 PA6 bidirectional TTa 3.3 V tolerant I/O with reduced touch sensing sensitivity; alternate functions include TIM16_CH1, TSC_G2_IO3, TIM1_BKIN and EVENTOUT, with ADC1_IN10 and OPAMP2_VOUT as additional functions.
17 PA7 bidirectional TTa 3.3 V tolerant I/O; alternate functions include TIM17_CH1, TSC_G2_IO4, TIM1_CH1N and EVENTOUT, with ADC1_IN15, COMP2_INP and OPAMP2_VINP as additional functions.
18 PB0 bidirectional TTa 3.3 V tolerant I/O; alternate functions include TSC_G3_IO2, TIM1_CH2N and EVENTOUT, with ADC1_IN11, COMP4_INP and OPAMP2_VINP as additional functions.
19 PB1 bidirectional TTa 3.3 V tolerant I/O; alternate functions include TSC_G3_IO3, TIM1_CH3N, COMP4_OUT and EVENTOUT, with ADC1_IN12 as an additional function.
20 PB2 bidirectional TTa 3.3 V tolerant I/O; alternate functions include TSC_G3_IO4 and EVENTOUT, with COMP4_INM as an additional function.
21 PB10 bidirectional TT 3.3 V tolerant I/O; alternate functions include TIM2_CH3, TSC_SYNC, USART3_TX and EVENTOUT.
22 PB11 bidirectional TTa 3.3 V tolerant I/O; alternate functions include TIM2_CH4, TSC_G6_IO1, USART3_RX and EVENTOUT, with ADC1_IN14 and COMP6_INP as additional functions.
23 VSS_2 power_in Digital ground.
24 VDD_2 power_in Digital power supply; VDD range is 2.0 to 3.6 V per the features list.
25 PB12 bidirectional TT 3.3 V tolerant I/O; alternate functions include TSC_G6_IO2, I2C2_SMBAL, SPI2_NSS/I2S2_WS, TIM1_BKIN, USART3_CK and EVENTOUT.
26 PB13 bidirectional TTa 3.3 V tolerant I/O; alternate functions include TSC_G6_IO3, SPI2_SCK/I2S2_CK, TIM1_CH1N, USART3_CTS and EVENTOUT, with ADC1_IN13 as an additional function.
27 PB14 bidirectional TTa 3.3 V tolerant I/O; alternate functions include TIM15_CH1, TSC_G6_IO4, SPI2_MISO/I2S2ext_SD, TIM1_CH2N, USART3_RTS_DE and EVENTOUT, with OPAMP2_VINP as an additional function.
28 PB15 bidirectional TTa 3.3 V tolerant I/O; alternate functions include RTC_REFIN, TIM15_CH2, TIM15_CH1N, TIM1_CH3N, SPI2_MOSI/I2S2_SD and EVENTOUT, with COMP6_INM as an additional function.
29 PA8 bidirectional FT 5 V tolerant I/O; alternate functions include MCO, I2C3_SCL, I2C2_SMBAL, I2S2_MCK, TIM1_CH1, USART1_CK and EVENTOUT.
30 PA9 bidirectional FTf 5 V tolerant I/O with I2C FM+ option; alternate functions include I2C3_SMBAL, TSC_G4_IO1, I2C2_SCL, I2S3_MCK, TIM1_CH2, USART1_TX, TIM15_BKIN, TIM2_CH3 and EVENTOUT.
31 PA10 bidirectional FTf 5 V tolerant I/O with I2C FM+ option; alternate functions include TIM17_BKIN, TSC_G4_IO2, I2C2_SDA, SPI2_MISO/I2S2ext_SD, TIM1_CH3, USART1_RX, COMP6_OUT, TIM2_CH4 and EVENTOUT.
32 PA11 bidirectional FT 5 V tolerant I/O; alternate functions include SPI2_MOSI/I2S2_SD, TIM1_CH1N, USART1_CTS, CAN_RX, TIM1_CH4, TIM1_BKIN2 and EVENTOUT, with USB_DM as an additional function.
33 PA12 bidirectional FT 5 V tolerant I/O; alternate functions include TIM16_CH1, I2SCKIN, TIM1_CH2N, USART1_RTS_DE, COMP2_OUT, CAN_TX, TIM1_ETR and EVENTOUT, with USB_DP as an additional function.
34 PA13 bidirectional FT 5 V tolerant I/O; printed functions include SWDIO, TIM16_CH1N, TSC_G4_IO3, IR-OUT, USART3_CTS and EVENTOUT.
35 VSS_3 power_in Digital ground.
36 VDD_3 power_in Digital power supply; VDD range is 2.0 to 3.6 V per the features list.
37 PA14 bidirectional FTf 5 V tolerant I/O with I2C FM+ option; printed functions include SWCLK-JTCK, TSC_G4_IO4, I2C1_SDA, TIM1_BKIN, USART2_TX and EVENTOUT.
38 PA15 bidirectional FTf 5 V tolerant I/O with I2C FM+ option; printed functions include JTDI, TIM2_CH1/TIM2_ETR, TSC_SYNC, I2C1_SCL, SPI3_NSS/I2S3_WS, USART2_RX, TIM1_BKIN and EVENTOUT.
39 PB3 bidirectional FT 5 V tolerant I/O; printed functions include JTDO-TRACESWO, TIM2_CH2, TSC_G5_IO1, SPI3_SCK/I2S3_CK, USART2_TX and EVENTOUT.
40 PB4 bidirectional FT 5 V tolerant I/O; printed functions include JTRST, TIM16_CH1, TSC_G5_IO2, SPI3_MISO/I2S3_ext_SD, USART2_RX, TIM17_BKIN and EVENTOUT.
41 PB5 bidirectional FT 5 V tolerant I/O; printed functions include TIM16_BKIN, I2C1_SMBAL, SPI3_MOSI/I2S3_SD, USART2_CK, I2C3_SDA, TIM17_CH1 and EVENTOUT.
42 PB6 bidirectional FTf 5 V tolerant I/O with I2C FM+ option; printed functions include TIM16_CH1N, TSC_G5_IO3, I2C1_SCL, USART1_TX and EVENTOUT.
43 PB7 bidirectional FTf 5 V tolerant I/O with I2C FM+ option; printed functions include TIM17_CH1N, TSC_G5_IO4, I2C1_SDA, USART1_RX and EVENTOUT.
44 BOOT0 input Dedicated BOOT0 pin used for boot memory selection.
45 PB8 bidirectional FTf 5 V tolerant I/O with I2C FM+ option; printed functions include TIM16_CH1, TSC_SYNC, I2C1_SCL, USART3_RX, CAN_RX, TIM1_BKIN and EVENTOUT.
46 PB9 bidirectional FTf 5 V tolerant I/O with I2C FM+ option; printed functions include TIM17_CH1, I2C1_SDA, IR-OUT, USART3_TX, COMP2_OUT, CAN_TX and EVENTOUT.
47 VSS_1 power_in Digital ground.
48 VDD_1 power_in Digital power supply; VDD range is 2.0 to 3.6 V per the features list.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package LQFP-48(7x7)
Category Embedded Processors & Controllers
Pins 48

CAD (KiCad official)

  • Symbol: STM32F302C6T6
  • Footprint: Package_QFP:LQFP-48_7x7mm_P0.5mm
  • 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: stm32f302c6t6-etched.step / stm32f302c6t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stm32f302c6t6.step / stm32f302c6t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (139 pp, sha256 4a5d8aab2b0eafd3, retrieved 2026-10-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF