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Contents

README

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STM32F071CBU6

STMicroelectronics · Microcontrollers (MCU/MPU/SOC) · UFQFPN-48(7x7)

STM32F071CBU6 from STMicroelectronics, in a UFQFPN-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model, then checked against ST open pin data); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup power supply for RTC, 32 kHz oscillator and backup registers, 1.65 to 3.6 V when VDD is not present.
2 PC13 bidirectional TC I/O supplied through the power switch (3 mA sink limit), output speed max 2 MHz with 30 pF load and not usable as a current source; additional functions WKUP2, RTC_TAMP1, RTC_TS, RTC_OUT.
3 PC14-OSC32_IN bidirectional TC I/O (PC14) supplied through the power switch with 2 MHz/30 pF output limit, also the OSC32_IN 32 kHz oscillator input.
4 PC15-OSC32_OUT bidirectional TC I/O (PC15) supplied through the power switch with 2 MHz/30 pF output limit, also the OSC32_OUT 32 kHz oscillator output.
5 PF0-OSC_IN bidirectional 5 V-tolerant I/O with alternate function CRS_SYNC, also the OSC_IN main oscillator input.
6 PF1-OSC_OUT bidirectional 5 V-tolerant I/O, also the OSC_OUT main oscillator output.
7 NRST bidirectional Device reset input / internal reset output (active low), bidirectional with embedded weak pull-up.
8 VSSA power_in Analog ground.
9 VDDA power_in Analog power supply from VDD to 3.6 V, minimum 2.4 V when ADC or DAC is used; must be established first and be at or above VDD.
10 PA0 bidirectional TTa I/O with USART2_CTS, TIM2_CH1_ETR, TSC_G1_IO1, USART4_TX; additional RTC_TAMP2, WKUP1, COMP1_OUT, ADC_IN0, COMP1_INM6.
11 PA1 bidirectional TTa I/O with USART2_RTS, TIM2_CH2, TIM15_CH1N, TSC_G1_IO2, USART4_RX, EVENTOUT; additional ADC_IN1, COMP1_INP.
12 PA2 bidirectional TTa I/O with USART2_TX, TIM2_CH3, TIM15_CH1, TSC_G1_IO3; additional ADC_IN2, COMP2_OUT, COMP2_INM6, WKUP4.
13 PA3 bidirectional TTa I/O with USART2_RX, TIM2_CH4, TIM15_CH2, TSC_G1_IO4; additional ADC_IN3, COMP2_INP.
14 PA4 bidirectional TTa I/O with SPI1_NSS, I2S1_WS, TIM14_CH1, TSC_G2_IO1, USART2_CK; additional COMP1_INM4, COMP2_INM4, ADC_IN4, DAC_OUT1.
15 PA5 bidirectional TTa I/O with SPI1_SCK, I2S1_CK, CEC, TIM2_CH1_ETR, TSC_G2_IO2; additional COMP1_INM5, COMP2_INM5, ADC_IN5, DAC_OUT2.
16 PA6 bidirectional TTa I/O with SPI1_MISO, I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1, COMP1_OUT, TSC_G2_IO3, EVENTOUT, USART3_CTS; additional ADC_IN6.
17 PA7 bidirectional TTa I/O with SPI1_MOSI, I2S1_SD, TIM3_CH2, TIM14_CH1, TIM1_CH1N, TIM17_CH1, COMP2_OUT, TSC_G2_IO4, EVENTOUT; additional ADC_IN7.
18 PB0 bidirectional TTa I/O with TIM3_CH3, TIM1_CH2N, TSC_G3_IO2, EVENTOUT, USART3_CK; additional ADC_IN8.
19 PB1 bidirectional TTa I/O with TIM3_CH4, USART3_RTS, TIM14_CH1, TIM1_CH3N, TSC_G3_IO3; additional ADC_IN9.
20 PB2 bidirectional 5 V-tolerant I/O with TSC_G3_IO4.
21 PB10 bidirectional 5 V-tolerant I/O with SPI2_SCK, I2C2_SCL, USART3_TX, CEC, TSC_SYNC, TIM2_CH3.
22 PB11 bidirectional 5 V-tolerant I/O with USART3_RX, TIM2_CH4, EVENTOUT, TSC_G6_IO1, I2C2_SDA.
23 VSS power_in Ground.
24 VDD power_in Digital power supply, 2.0 to 3.6 V.
25 PB12 bidirectional 5 V-tolerant I/O with TIM1_BKIN, TIM15_BKIN, SPI2_NSS, I2S2_WS, USART3_CK, TSC_G6_IO2, EVENTOUT.
26 PB13 bidirectional 5 V-tolerant FM+ capable I/O with SPI2_SCK, I2S2_CK, I2C2_SCL, USART3_CTS, TIM1_CH1N, TSC_G6_IO3.
27 PB14 bidirectional 5 V-tolerant FM+ capable I/O with SPI2_MISO, I2S2_MCK, I2C2_SDA, USART3_RTS, TIM1_CH2N, TIM15_CH1, TSC_G6_IO4.
28 PB15 bidirectional 5 V-tolerant I/O with SPI2_MOSI, I2S2_SD, TIM1_CH3N, TIM15_CH1N, TIM15_CH2; additional WKUP7, RTC_REFIN.
29 PA8 bidirectional 5 V-tolerant I/O supplied by VDDIO2 with USART1_CK, TIM1_CH1, EVENTOUT, MCO, CRS_SYNC.
30 PA9 bidirectional 5 V-tolerant I/O supplied by VDDIO2 with USART1_TX, TIM1_CH2, TIM15_BKIN, TSC_G4_IO1.
31 PA10 bidirectional 5 V-tolerant I/O supplied by VDDIO2 with USART1_RX, TIM1_CH3, TIM17_BKIN, TSC_G4_IO2.
32 PA11 bidirectional 5 V-tolerant I/O supplied by VDDIO2 with USART1_CTS, TIM1_CH4, COMP1_OUT, TSC_G4_IO3, EVENTOUT.
33 PA12 bidirectional 5 V-tolerant I/O supplied by VDDIO2 with USART1_RTS, TIM1_ETR, COMP2_OUT, TSC_G4_IO4, EVENTOUT.
34 PA13 bidirectional 5 V-tolerant I/O supplied by VDDIO2, SWDIO after reset with internal pull-up activated; also IR_OUT.
35 VSS power_in Ground.
36 VDDIO2 power_in Digital supply for the I/Os marked as VDDIO2, 1.65 to 3.6 V, independent of VDD but not to be provided without valid VDD.
37 PA14 bidirectional 5 V-tolerant I/O supplied by VDDIO2, SWCLK after reset with internal pull-down activated; also USART2_TX.
38 PA15 bidirectional 5 V-tolerant I/O supplied by VDDIO2 with SPI1_NSS, I2S1_WS, USART2_RX, USART4_RTS, TIM2_CH1_ETR, EVENTOUT.
39 PB3 bidirectional 5 V-tolerant I/O with SPI1_SCK, I2S1_CK, TIM2_CH2, TSC_G5_IO1, EVENTOUT.
40 PB4 bidirectional 5 V-tolerant I/O with SPI1_MISO, I2S1_MCK, TIM17_BKIN, TIM3_CH1, TSC_G5_IO2, EVENTOUT.
41 PB5 bidirectional 5 V-tolerant I/O with SPI1_MOSI, I2S1_SD, I2C1_SMBA, TIM16_BKIN, TIM3_CH2; additional WKUP6.
42 PB6 bidirectional 5 V-tolerant FM+ capable I/O with I2C1_SCL, USART1_TX, TIM16_CH1N, TSC_G5_IO3.
43 PB7 bidirectional 5 V-tolerant FM+ capable I/O with I2C1_SDA, USART1_RX, USART4_CTS, TIM17_CH1N, TSC_G5_IO4.
44 BOOT0 input Dedicated boot memory selection input.
45 PB8 bidirectional 5 V-tolerant FM+ capable I/O with I2C1_SCL, CEC, TIM16_CH1, TSC_SYNC.
46 PB9 bidirectional 5 V-tolerant FM+ capable I/O with SPI2_NSS, I2S2_WS, I2C1_SDA, IR_OUT, TIM17_CH1, EVENTOUT.
47 VSS power_in Ground.
48 VDD power_in Digital power supply, 2.0 to 3.6 V.
49 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package UFQFPN-48(7x7)
Category Embedded Processors & Controllers
Pins 49

CAD (KiCad official)

  • Symbol: STM32F071CBU6
  • Footprint: Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
  • 3D model: UFQFPN-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: stm32f071cbu6-etched.step / stm32f071cbu6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stm32f071cbu6.step / stm32f071cbu6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (122 pp, sha256 054f3806403d4305, retrieved 2026-10-03, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF