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Contents

README

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STM32F031F4P6

STMicroelectronics · Microcontrollers (MCU/MPU/SOC) · TSSOP-20

STM32F031F4P6 from STMicroelectronics, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model, then checked against ST open pin data); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT0 input Dedicated boot-selection input (I/O structure type B) used with the boot-selector option bit at startup to choose between booting from user Flash, System memory (bootloader), or embedded SRAM; absolute maximum input voltage range is 0 to 9.0 V.
2 PF0 bidirectional 5V-tolerant (FT) general-purpose I/O PF0 (floating input after reset) that can alternatively be configured as OSC_IN, the input of the 4-32 MHz external HSE crystal/resonator or external clock source.
3 PF1 bidirectional 5V-tolerant (FT) general-purpose I/O PF1 (floating input after reset) that can alternatively be configured as OSC_OUT, the output of the 4-32 MHz external HSE crystal/resonator oscillator.
4 NRST bidirectional Bidirectional reset pin (RST structure) with an embedded weak pull-up resistor (typ. 40 kΩ); active-low external reset input and internal power-on/power-down reset output.
5 VDDA power_in External analog power supply pin for the ADC, reset block, RC oscillators and PLL; must be from VDD up to 3.6 V (minimum 2.4 V when the ADC is used) and must be established before or with VDD.
6 PA0 bidirectional 3.3V ADC-tolerant (TTa) I/O PA0 with alternate functions TIM2_CH1_ETR and USART1_CTS, and additional functions ADC_IN0, RTC_TAMP2 and WKUP1 (Standby-mode wakeup pin 1).
7 PA1 bidirectional TTa I/O PA1 with alternate functions TIM2_CH2, EVENTOUT and USART1_RTS, and additional function ADC_IN1.
8 PA2 bidirectional TTa I/O PA2 with alternate functions USART1_TX and TIM2_CH3, and additional function ADC_IN2.
9 PA3 bidirectional TTa I/O PA3 with alternate functions USART1_RX and TIM2_CH4, and additional function ADC_IN3.
10 PA4 bidirectional TTa I/O PA4 with alternate functions SPI1_NSS/I2S1_WS, USART1_CK and TIM14_CH1, and additional function ADC_IN4.
11 PA5 bidirectional TTa I/O PA5 with alternate functions SPI1_SCK/I2S1_CK and TIM2_CH1_ETR, and additional function ADC_IN5.
12 PA6 bidirectional TTa I/O PA6 with alternate functions SPI1_MISO/I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1 and EVENTOUT, and additional function ADC_IN6.
13 PA7 bidirectional TTa I/O PA7 with alternate functions SPI1_MOSI/I2S1_SD, TIM3_CH2, TIM14_CH1, TIM1_CH1N, TIM17_CH1 and EVENTOUT, and additional function ADC_IN7.
14 PB1 bidirectional TTa I/O PB1 with alternate functions TIM3_CH4, TIM14_CH1 and TIM1_CH3N, and additional function ADC_IN9.
15 VSS power_in Ground pin; the TSSOP20 package has no separate VSSA pin, so per datasheet note (3) the VSSA pad of the die is internally connected to this VSS pin.
16 VDD power_in Digital power supply pin, 2.0 V to 3.6 V, for the I/O ring (VDDIO1) and the internal voltage regulator.
17 PA9 bidirectional 5V-tolerant, Fast-mode-Plus-capable (FTf) I/O PA9 with alternate functions USART1_TX, TIM1_CH2 and I2C1_SCL (I2C1 supports Fast Mode Plus up to 1 Mbit/s with 20 mA sink on this pin).
18 PA10 bidirectional FTf I/O PA10 with alternate functions USART1_RX, TIM1_CH3, TIM17_BKIN and I2C1_SDA (I2C1 supports Fast Mode Plus up to 1 Mbit/s with 20 mA sink on this pin).
19 PA13 bidirectional 5V-tolerant (FT) I/O PA13 with alternate functions IR_OUT and SWDIO; per note (5), after reset this pin defaults to the SWDIO alternate function with its internal pull-up resistor activated.
20 PA14 bidirectional FT I/O PA14 with alternate functions USART1_TX and SWCLK; per note (5), after reset this pin defaults to the SWCLK alternate function with its internal pull-down resistor activated.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package TSSOP-20
Category Embedded Processors & Controllers
Pins 20

CAD (KiCad official)

  • Symbol: STM32F031F4P6
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: stm32f031f4p6-etched.step / stm32f031f4p6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stm32f031f4p6.step / stm32f031f4p6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (106 pp, sha256 36b17e3dce795273, retrieved 2026-09-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF