component
STM32C071CBT6
Public Made by Adomby adom
ST(意法半导体) Global Sourcing Parts, LQFP-48(7x7). Pinout checked against ST's open pin data, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| package.json | 17d ago |
| page.json | 17d ago |
| README.md | 17d ago |
| stm32c071cbt6-etched.glb | 17d ago |
| stm32c071cbt6-etched.step | 17d ago |
| stm32c071cbt6-hero.glb | 17d ago |
| stm32c071cbt6-hero.overlay.json | 17d ago |
| stm32c071cbt6.glb | 17d ago |
| stm32c071cbt6.kicad_mod | 17d ago |
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| stm32c071cbt6.lbr | 17d ago |
| stm32c071cbt6.step | 17d ago |
STM32C071CBT6
ST(意法半导体) · Global Sourcing Parts · LQFP-48(7x7)
STM32C071CBT6 from ST(意法半导体), in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model, then checked against ST open pin data); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PC13 | bidirectional | 5 V-tolerant (FT) I/O with alternate functions TIM1_ETR and TIM1_BKIN and additional functions RTC_TS, RTC_OUT1 and WKUP2. |
| 2 | PC14-OSCX_IN | bidirectional | 5 V-tolerant I/O with FT_f structure (Fm+ capable), serving as OSCX_IN with alternate functions including USART1_TX, TIM1_ETR, TIM1_BKIN2, IR_OUT, TIM17_CH1, TIM3_CH2, SPI2_NSS, I2C1_SDA and EVENTOUT. |
| 3 | PC15-OSCX_OUT | bidirectional | 5 V-tolerant (FT) I/O serving as OSCX_OUT, with alternate functions OSC32_EN, OSC_EN, TIM1_ETR and TIM3_CH3. |
| 4 | PF3 | bidirectional | 5 V-tolerant (FT) I/O with no alternate or additional functions listed in Table 12. |
| 5 | VREF+ | power_in | Positive reference voltage for the ADC, specified from 2 V up to VDD in Table 55. |
| 6 | VDD/VDDA | power_in | Main digital and analog supply pin; standard operating voltage VDD is 2.0 V to 3.6 V (Table 24). |
| 7 | VSS/VSSA | power_in | Ground pin for the digital and analog supply; all voltages are referenced to VSS. |
| 8 | PF0-OSC_IN | bidirectional | 5 V-tolerant (FT) I/O serving as OSC_IN, with alternate functions CRS_SYNC and TIM14_CH1. |
| 9 | PF1-OSC_OUT | bidirectional | 5 V-tolerant (FT) I/O serving as OSC_OUT, with alternate function OSC_EN. |
| 10 | PF2-NRST | bidirectional | Reset pin with embedded weak pull-up (RST structure) when configured as reset, becoming a 5 V-tolerant FT I/O when configured as GPIO; alternate functions MCO and TIM1_CH4. |
| 11 | PA0 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions include SPI2_SCK, USART2_CTS/USART2_NSS, TIM16_CH1, TIM2_CH1, USART1_TX and TIM1_CH1, additional functions ADC_IN0 and WKUP1. |
| 12 | PA1 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions include SPI1_SCK/I2S1_CK, USART2_RTS/USART2_DE/USART2_CK, TIM17_CH1, TIM2_CH2, USART1_RX, TIM1_CH2, I2C1_SMBA and EVENTOUT, additional function ADC_IN1. |
| 13 | PA2 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions include SPI1_MOSI/I2S1_SD, USART2_TX, TIM16_CH1N, TIM3_ETR, TIM1_CH3 and TIM2_CH3, additional functions ADC_IN2, WKUP4 and LSCO. |
| 14 | PA3 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions include SPI2_MISO, USART2_RX, TIM1_CH1N, TIM2_CH4, TIM1_CH4 and EVENTOUT, additional function ADC_IN3. |
| 15 | PA4 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions include SPI1_NSS/I2S1_WS, USART2_TX, TIM1_CH2N, SPI2_MOSI, TIM14_CH1, TIM17_CH1N, USB_NOE and EVENTOUT, additional functions ADC_IN4 and RTC_OUT2. |
| 16 | PA5 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions include SPI1_SCK/I2S1_CK, USART2_RX, TIM1_CH3N, TIM2_CH1, TIM1_CH1 and EVENTOUT, additional function ADC_IN5. |
| 17 | PA6 | bidirectional | 5 V-tolerant I/O with FT_fa structure (Fm+ capable, analog switch); alternate functions include SPI1_MISO/I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1 and I2C2_SDA, additional function ADC_IN6. |
| 18 | PA7 | bidirectional | 5 V-tolerant I/O with FT_fa structure (Fm+ capable, analog switch); alternate functions include SPI1_MOSI/I2S1_SD, TIM3_CH2, TIM1_CH1N, TIM14_CH1, TIM17_CH1 and I2C2_SCL, additional function ADC_IN7. |
| 19 | PB0 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions SPI1_NSS/I2S1_WS, TIM3_CH3 and TIM1_CH2N, additional function ADC_IN17. |
| 20 | PB1 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions include TIM14_CH1, TIM3_CH4, TIM1_CH3N, TIM1_CH2N and EVENTOUT, additional function ADC_IN18. |
| 21 | PB2 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions USART1_RX, MCO2, SPI2_MISO and EVENTOUT, additional function ADC_IN19. |
| 22 | PB10 | bidirectional | 5 V-tolerant I/O with FT_fa structure (Fm+ capable, analog switch); alternate functions TIM2_CH3, SPI2_SCK and I2C2_SCL, additional function ADC_IN20. |
| 23 | PB11 | bidirectional | 5 V-tolerant I/O with FT_fa structure (Fm+ capable, analog switch); alternate functions SPI2_MOSI, TIM2_CH4 and I2C2_SDA, additional function ADC_IN21. |
| 24 | PB12 | bidirectional | 5 V-tolerant I/O with analog switch (FT_a); alternate functions SPI2_NSS, TIM1_BKIN2, TIM1_BKIN and EVENTOUT, additional function ADC_IN22. |
| 25 | PB13 | bidirectional | 5 V-tolerant I/O with FT_sfa structure, supplied only by VDDIO2 (internally tied to VDD on GP packages), with alternate functions SPI2_SCK, TIM1_CH1N, I2C2_SCL and EVENTOUT. |
| 26 | PB14 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions SPI2_MISO, TIM1_CH2N, I2C2_SDA and EVENTOUT. |
| 27 | PB15 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions SPI2_MOSI, TIM1_CH3N and EVENTOUT, additional function RTC_REFIN. |
| 28 | PA8 | bidirectional | 5 V-tolerant I/O with analog switch (FT_sa), supplied by VDDIO2 structure per Table 11; alternate functions include MCO, USART2_TX, TIM1_CH1, SPI2_NSS, CRS_SYNC, SPI2_MISO, EVENTOUT and MCO2, additional function ADC_IN8. |
| 29 | PA9 | bidirectional | 5 V-tolerant I/O with FT_sf structure that can be remapped in place of PA11 via SYSCFG_CFGR1; alternate functions include MCO, USART1_TX, TIM1_CH2, TIM3_ETR, SPI2_MISO, I2C1_SCL, EVENTOUT and I2C2_SCL. |
| 30 | PC6 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions TIM3_CH1 and TIM2_CH3. |
| 31 | PC7 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions TIM3_CH2 and TIM2_CH4. |
| 32 | PA10 | bidirectional | 5 V-tolerant I/O with FT_sf structure that can be remapped in place of PA12 via SYSCFG_CFGR1; alternate functions SPI2_MOSI, USART1_RX, TIM1_CH3, MCO2, TIM17_BKIN, I2C1_SDA, EVENTOUT and I2C2_SDA. |
| 33 | PA11 [PA9] | bidirectional | 5 V-tolerant USB-capable I/O (FT_usf) with default function PA11 and remap option to PA9; alternate functions SPI1_MISO/I2S1_MCK, USART1_CTS/USART1_NSS, TIM1_CH4, TIM1_BKIN2 and I2C2_SCL, additional function USB_DM. |
| 34 | PA12 [PA10] | bidirectional | 5 V-tolerant USB-capable I/O (FT_usf) with default function PA12 and remap option to PA10; alternate functions SPI1_MOSI/I2S1_SD, USART1_RTS/USART1_DE/USART1_CK, TIM1_ETR, I2S_CKIN and I2C2_SDA, additional function USB_DP. |
| 35 | PA13 | bidirectional | 5 V-tolerant I/O with analog switch (FT_sa) that is configured as SWDIO with internal pull-up after reset; alternate functions include IR_OUT, USB_NOE, TIM3_ETR, USART2_RX and EVENTOUT, additional function ADC_IN13. |
| 36 | PA14-BOOT0 | bidirectional | 5 V-tolerant I/O with analog switch (FT_sa) that is configured as SWCLK with internal pull-down after reset; alternate functions include USART2_TX, EVENTOUT, SPI1_NSS/I2S1_WS, USART2_RX, TIM1_CH1 and MCO2, additional functions ADC_IN14 and BOOT0. |
| 37 | PA15 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions include SPI1_NSS/I2S1_WS, USART2_RX, TIM1_CH1, MCO2, TIM2_CH1, USB_NOE and EVENTOUT. |
| 38 | PD0 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions EVENTOUT, TIM16_CH1 and SPI2_NSS. |
| 39 | PD1 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions EVENTOUT, TIM17_CH1 and SPI2_SCK. |
| 40 | PD2 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions TIM3_ETR and TIM1_CH1N. |
| 41 | PD3 | bidirectional | 5 V-tolerant I/O with FT_s structure, supplied only by VDDIO2; alternate functions USART2_CTS/USART2_NSS, TIM1_CH2N and SPI2_MISO. |
| 42 | PB3 | bidirectional | 5 V-tolerant I/O with FT_f structure (Fm+ capable); alternate functions SPI1_SCK/I2S1_CK, TIM1_CH2, TIM3_CH2, USART1_RTS/USART1_DE/USART1_CK, I2C2_SCL, TIM2_CH2 and EVENTOUT. |
| 43 | PB4 | bidirectional | 5 V-tolerant I/O with FT_f structure (Fm+ capable); alternate functions SPI1_MISO/I2S1_MCK, TIM3_CH1, USART1_CTS/USART1_NSS, TIM17_BKIN, I2C2_SDA and EVENTOUT. |
| 44 | PB5 | bidirectional | 5 V-tolerant I/O (FT); alternate functions SPI1_MOSI/I2S1_SD, TIM3_CH2, TIM16_BKIN, TIM3_CH3 and I2C1_SMBA, additional function WKUP6. |
| 45 | PB6 | bidirectional | 5 V-tolerant I/O with FT_f structure (Fm+ capable); alternate functions include USART1_TX, TIM1_CH3, TIM16_CH1N, TIM3_CH3, SPI2_MISO, USART1_NSS/USART1_CTS, I2C1_SCL and I2C1_SMBA, additional function WKUP3. |
| 46 | PB7 | bidirectional | 5 V-tolerant I/O with FT_f structure (Fm+ capable); alternate functions include USART1_RX, TIM1_CH4, TIM17_CH1N, TIM3_CH4, SPI2_MOSI, I2C1_SDA, EVENTOUT and USART2_CTS/USART2_NSS. |
| 47 | PB8 | bidirectional | 5 V-tolerant I/O with FT_f structure (Fm+ capable); alternate functions USART2_CTS/USART2_NSS, TIM16_CH1, TIM3_CH1, SPI2_SCK, I2C1_SCL and EVENTOUT. |
| 48 | PB9 | bidirectional | 5 V-tolerant I/O with FT_f structure (Fm+ capable); alternate functions IR_OUT, USART2_RTS/USART2_DE/USART2_CK, TIM17_CH1, TIM3_CH2, SPI2_NSS, I2C1_SDA and EVENTOUT. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ST(意法半导体) |
| Package | LQFP-48(7x7) |
| Category | Global Sourcing Parts |
| Pins | 48 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| External supply voltage | VDD | -0.3 | 4 | V | 51 | ||
| External supply voltage for selected I/Os | VDDIO2 | -0.3 | 4 | V | 51 | ||
| External voltage on VREF+ pin | VREF+ | -0.3 | V | 51 | |||
| Input voltage on pin | VIN | -0.3 | V | 51 | |||
| Current into VDD/VDDA and VDDIO2 power pins (source) | IVDD/VDDA,VDDIO2 | 100 | mA | 51 | |||
| Current out of VSS/VSSA ground pin (sink) | IVSS/VSSA | 100 | mA | 51 | |||
| Output current sunk by any I/O and control pin | IIO(PIN) | 20 | mA | 51 | |||
| Output current sourced by any I/O and control pin | IIO(PIN) | 20 | mA | 51 | |||
| Total output current sunk by sum of all I/Os and control pins | ∑I(PIN) | 80 | mA | 51 | |||
| Total output current sourced by sum of all I/Os and control pins | ∑I(PIN) | 80 | mA | 51 | |||
| Injected current on a FT_xx pin | IINJ(PIN) | -5 | mA | 52 | |||
| Total injected current (sum of all I/Os and control pins) | ∑IINJ(PIN) | -25 | mA | 52 | |||
| Storage temperature range | TSTG | -65 | 150 | °C | 52 | ||
| Maximum junction temperature | TJ | 130 | °C | 52 | |||
| Standard operating voltage | VDD | 2 | 3.6 | V | 53 | ||
| External supply voltage for selected I/Os | VDDIO2 | 1.65 | 3.6 | V | 53 | ||
| I/O input voltage | VIN | -0.3 | V | 53 | |||
| AHB clock frequency | fHCLK | 48 | MHz | 53 | |||
| APB clock frequency | fPCLK | 48 | MHz | 53 | |||
| Ambient temperature (order code suffix 6) | TA | -40 | 85 | °C | Suffix 6 | 53 | |
| Junction temperature (order code suffix 6) | TJ | -40 | 105 | °C | Suffix 6 | 53 | |
| VDD rise time rate | tVDD | 0 | µs/V | 53 | |||
| VDD fall time rate | 10 | µs/V | 53 | ||||
| POR temporization when VDD crosses VPOR | tRSTTEMPO | 270 | 500 | µs | VDD rising | 54 | |
| Power-on reset threshold | VPOR | 1.9 | 1.94 | 1.98 | V | 54 | |
| Power-down reset threshold | VPDR | 1.88 | 1.92 | 1.96 | V | 54 | |
| Brownout reset threshold 1 | VBOR1 | 2.05 | 2.1 | 2.18 | V | VDD rising | 54 |
| Brownout reset threshold 1 | VBOR1 | 1.95 | 2 | 2.08 | V | VDD falling | 54 |
| Brownout reset threshold 2 | VBOR2 | 2.2 | 2.31 | 2.38 | V | VDD rising | 54 |
| Brownout reset threshold 2 | VBOR2 | 2.1 | 2.21 | 2.28 | V | VDD falling | 54 |
| Brownout reset threshold 3 | VBOR3 | 2.5 | 2.62 | 2.68 | V | VDD rising | 54 |
| Brownout reset threshold 3 | VBOR3 | 2.4 | 2.52 | 2.58 | V | VDD falling | 54 |
| Brownout reset threshold 4 | VBOR4 | 2.8 | 2.91 | 3 | V | VDD rising | 54 |
| Brownout reset threshold 4 | VBOR4 | 2.7 | 2.81 | 2.9 | V | VDD falling | 54 |
| BOR consumption from VDD | IDD(BOR) | 2.2 | 2.5 | µA | 54 | ||
| Internal reference voltage | VREFINT | 1.182 | 1.212 | 1.232 | V | 54 | |
| Start time of reference voltage buffer when ADC is enabled | tstart_vrefint | 8 | 12 | µs | 54 | ||
| Internal reference voltage spread over the temperature range | ∆VREFINT | 30 | 50 | mV | VDD = 3 V | 54 | |
| Average temperature coefficient | TCoeff | 20 | 70 | ppm/°C | 54 | ||
| Long term stability | ACoeff | 300 | 1000 | ppm | 1000 hours, T = 25 °C | 54 | |
| Voltage coefficient | VDDCoeff | 250 | 1200 | ppm/V | 3.0 V < VDD < 3.6 V | 54 | |
| Supply current in Run mode, flash memory, 25 °C | IDD(Run) | 3.7 | 4 | mA | fHCLK 48 MHz, fetch from flash, 25 °C; typ at VDD 3.0 V, max at 3.6 V | 56 | |
| Supply current in Run mode, flash memory, 125 °C | IDD(Run) | 4.2 | 5 | mA | fHCLK 48 MHz, fetch from flash, 125 °C; typ at VDD 3.0 V, max at 3.6 V | 56 | |
| Supply current in Run mode, SRAM, 25 °C | IDD(Run) | 3.1 | 3.4 | mA | fHCLK 48 MHz, fetch from SRAM, 25 °C; typ at VDD 3.0 V, max at 3.6 V | 57 | |
| Supply current in Sleep mode, flash enabled, 25 °C | IDD(Sleep) | 0.77 | 0.97 | mA | fHCLK 48 MHz, all peripherals disabled, 25 °C; typ at VDD 3.0 V, max at 3.6 V | 61 | |
| Supply current in Sleep mode, flash enabled, 125 °C | IDD(Sleep) | 1.2 | 2.1 | mA | fHCLK 48 MHz, all peripherals disabled, 125 °C; typ at VDD 3.0 V, max at 3.6 V | 61 | |
| Supply current in Stop mode, all clocks off, 25 °C | IDD(Stop) | 87.5 | 120 | µA | All clocks off, VDD 3.6 V, 25 °C | 63 | |
| Supply current in Stop mode, all clocks off, 125 °C | IDD(Stop) | 495 | 1200 | µA | All clocks off, VDD 3.6 V, 125 °C | 63 | |
| Supply current in Standby mode, all clocks off, 25 °C | IDD(Standby) | 7.75 | 9.5 | µA | All clocks off, VDD 3.6 V, 25 °C | 64 | |
| Supply current in Shutdown mode, all clocks off, 25 °C | IDD(Shutdown) | 41 | 130 | nA | All clocks off, VDD 3.6 V, 25 °C | 64 | |
| Wake-up time from Sleep to Run mode, flash powered during Sleep | tWUSLEEP | 10 | 12 | CPU clock cycles | HCLK = HSI48/4 = 12 MHz | 68 | |
| Wake-up time from Sleep to Run mode, flash not powered during Sleep | tWUSLEEP | 4.74 | 5.02 | µs | HCLK = HSI48/4 = 12 MHz | 68 | |
| Wake-up time from Stop mode, flash powered during Stop | tWULPSTOP | 2.7 | 3.1 | µs | Clock after wake-up HCLK = HSI48/4 = 12 MHz | 68 | |
| Wake-up time from Stop mode, flash not powered during Stop | tWULPSTOP | 5.9 | 6.4 | µs | Clock after wake-up HCLK = HSI48/4 = 12 MHz | 68 | |
| Wake-up time from Standby mode | tWUSTBY | 23 | 35 | µs | Clock after wake-up HCLK = HSI48/4 = 12 MHz | 68 | |
| Wake-up time from Shutdown mode | tWUSHDN | 385 | 466 | µs | Clock after wake-up HCLK = HSI48/4 = 12 MHz | 68 | |
| Oscillator frequency (HSE crystal/ceramic) | fOSC_IN | 4 | 48 | MHz | 70 | ||
| HSI48 frequency | fHSI48 | 47.92 | 48.4 | MHz | VDD = 3.0 V, TA = 30 °C | 72 | |
| ADC power supply voltage | VDDA | 2 | 3.6 | V | 84 | ||
| ADC clock frequency | fADC | 0.14 | 35 | MHz | 84 | ||
| Sampling rate, 12-bit resolution | fs | 2.5 | MSps | 12 bits | 84 |
CAD (KiCad official)
- Symbol:
STM32C071CBT6 - Footprint:
Package_QFP:LQFP-48_7x7mm_P0.5mm - 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
- 3D model files:
stm32c071cbt6-etched.step/stm32c071cbt6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);stm32c071cbt6.step/stm32c071cbt6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ST(意法半导体) datasheet (129 pp, sha256
47df10c3b7af4b1b, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).