main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 10d ago
viewers std30nf06lt4-hxy: viewers · Ray 10d ago
package.json Publish 0.1.0 · Ray 10d ago
page.json Set visibility: public · Ray 10d ago
README.md Publish 0.1.0 · Ray 10d ago
std30nf06lt4-hxy-etched.glb Publish 0.1.0 · Ray 10d ago
std30nf06lt4-hxy-etched.step std30nf06lt4-hxy: factory component page (tier=lcsc) · Ray 10d ago
std30nf06lt4-hxy-hero.glb std30nf06lt4-hxy: hero GLB from the etched model (keeps the MPN mark) · Ray 10d ago
std30nf06lt4-hxy-hero.overlay.json Publish 0.1.0 · Ray 10d ago
std30nf06lt4-hxy.glb Publish 0.1.0 · Ray 10d ago
std30nf06lt4-hxy.kicad_mod Publish 0.1.0 · Ray 10d ago
std30nf06lt4-hxy.kicad_sym Publish 0.1.0 · Ray 10d ago
std30nf06lt4-hxy.lbr Publish 0.1.0 · Ray 10d ago
std30nf06lt4-hxy.step Publish 0.1.0 · Ray 10d ago

STD30NF06LT4-HXY

HXY MOSFET · MOSFETs · TO-252-2L

STD30NF06LT4-HXY from HXY MOSFET, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal, rated for a gate-source voltage VGS of ±20 V per the absolute maximum ratings.
2 D passive Drain terminal, rated for a drain-source voltage VDS of 60 V and a continuous drain current ID of 30 A at TC=25℃ with VGS=10V.
3 S passive Source terminal, carrying a continuous source current IS of up to 23 A, which must be limited by total power dissipation in real applications.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-252-2L
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 30 A TC=25℃, VGS @ 10V 1
Continuous Drain Current ID 15 A TC=100℃, VGS @ 10V 1
Pulsed Drain Current IDM 46 A pulse width ≦300us, duty cycle ≦2% (note 2) 1
Single Pulse Avalanche Energy EAS 25.5 mJ VDD=25V,VGS=10V,L=0.1mH,IAS=22.6A (note 3) 1
Avalanche Current IAS 22.6 A 1
Total Power Dissipation PD 34.7 W TC=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-Ambient RθJA 62 ℃/W surface mounted on 1 inch2 FR-4 board, 2OZ copper (note 1) 1
Thermal Resistance Junction-Case RθJC 3.6 ℃/W note 1 1
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 22 26 mΩ VGS=10V, ID=15A 2
Static Drain-Source On-Resistance RDS(ON) 30 38 mΩ VGS=4.5V, ID=10A 2
Gate Threshold Voltage VGS(th) 1.2 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=48V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 5 uA VDS=48V, VGS=0V, TJ=55℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS 23 A VG=VD=0V, Force Current (notes 1,5) 2
Pulsed Source Current ISM 46 A notes 2,5 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=1A, TJ=25℃ 2
BVDSS Temperature Coefficient △BVDSS/△TJ 0.063 V/℃ Reference to 25℃, ID=1mA 2
VGS(th) Temperature Coefficient △VGS(th) -5.24 mV/℃ 2
Forward Transconductance gfs 17 S VDS=5V, ID=15A 2
Gate Resistance Rg 3.2 Ω VDS=0V, VGS=0V, f=1MHz 2
Total Gate Charge (4.5V) Qg 12.6 nC VDS=48V, VGS=4.5V, ID=12A 2
Gate-Source Charge Qgs 3.2 nC VDS=48V, VGS=4.5V, ID=12A 2
Gate-Drain Charge Qgd 6.3 nC VDS=48V, VGS=4.5V, ID=12A 2
Turn-On Delay Time Td(on) 8 ns VDD=30V, VGS=10V, RG=3.3, ID=10A 2
Rise Time Tr 14.2 ns VDD=30V, VGS=10V, RG=3.3, ID=10A 2
Turn-Off Delay Time Td(off) 24.4 ns VDD=30V, VGS=10V, RG=3.3, ID=10A 2
Fall Time Tf 4.6 ns VDD=30V, VGS=10V, RG=3.3, ID=10A 2
Input Capacitance Ciss 1378 pF VDS=15V, VGS=0V, f=1MHz 2
Output Capacitance Coss 86 pF VDS=15V, VGS=0V, f=1MHz 2
Reverse Transfer Capacitance Crss 64 pF VDS=15V, VGS=0V, f=1MHz 2

CAD (KiCad official)

  • Symbol: STD30NF06LT4-HXY
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: std30nf06lt4-hxy-etched.step / std30nf06lt4-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); std30nf06lt4-hxy.step / std30nf06lt4-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 3c6216a6dcd3190c, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF