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Ray Publish 0.1.0 f6d6676 23d ago

STD30NF06L

UMW · MOSFETs · TO-252

STD30NF06L from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; the gate-source voltage is rated at ±20V (VGS), and the gate threshold is 1 to 2.5V (VGS(th)) at IDS=250µA.
2 D passive Drain terminal; the drain-source voltage is rated at 60V (VDS) with continuous drain current of 30A at TC=25°C.
3 S passive Source terminal; it is the reference for the gate-source voltage rating (VGS ±20V).

Key specifications

Parameter Value
Manufacturer UMW
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V, IDS=250µA 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS=60V, VGS=0V 2
Gate-Body Leakage IGSS -100 100 nA VGS=±20V, VDS=0V 2
Gate Threshold Voltage VGS(th) 1 1.6 2.5 V VDS=VGS, IDS=250µA 2
Drain-Source On-State Resistance RDS(ON) 23 mΩ VGS=10V, IDS=15A 2
Drain-Source On-State Resistance RDS(ON) 29 mΩ VGS=4.5V, IDS=10A 2
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 30 A TC=25°C 1
Drain Current-Continuous ID 20 A TC=100°C 1
Drain Current-Pulsed IDM 120 A Note 1: repetitive rating, pulse width limited by maximum junction temperature 1
Avalanche Energy EAS 72 mJ Note 4: L=0.5mH, VDD=30V, VG=10V, VGATE=60V, Start TJ=25°C 1
Maximum Power Dissipation PD 55 W TC=25°C 1
Storage Temperature Range TSTG -55 150 °C 1
Junction Temperature Range TJ -55 150 °C 1
Thermal Resistance, Junction-to-Case RthJC 2.7 °C/W 2

CAD (KiCad official)

  • Symbol: STD30NF06L
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: std30nf06l-etched.step / std30nf06l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); std30nf06l.step / std30nf06l.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (9 pp, sha256 56bf8b877ffb0d40, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF