component
STD16NF25
Public Made by Adomby adom
STMicroelectronics MOSFETs, TO-252-2(DPAK). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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std16nf25: specified limits as data (metadata.characteristics, 27 rows from the datasheet)
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STD16NF25
STMicroelectronics · MOSFETs · TO-252-2(DPAK)
STD16NF25 from STMicroelectronics, in a TO-252-2(DPAK). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate control input; VGS = ±20 V max, VGS(th) = 2-4 V at ID = 250 µA |
| 2 | Drain | passive | Drain terminal; VDS = 250 V max, ID = 14 A continuous at 25 °C, 8.8 A at 100 °C |
| 3 | Source | passive | Source terminal and reference return for the drain-source channel |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TO-252-2(DPAK) |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate threshold voltage | VGS(th) | 2 | 3 | 4 | V | VDS = VGS, ID = 250 µA | 3 |
| Static drain-source on resistance | RDS(on) | 195 | 235 | mΩ | VGS = 10 V, ID = 6.5 A | 3 | |
| Drain-source breakdown voltage | V(BR)DSS | 250 | V | VGS = 0 V, ID = 1 mA | 3 | ||
| Zero gate voltage drain current | IDSS | 1 | µA | VGS = 0 V, VDS = 250 V | 3 | ||
| Zero gate voltage drain current (TC = 125 °C) | IDSS | 10 | µA | VGS = 0 V, VDS = 250 V, TC = 125 °C | 3 | ||
| Gate-body leakage current | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±20 V | 3 | |
| Source-drain current | ISD | 14 | A | 4 | |||
| Source-drain current (pulsed) | ISDM | 56 | A | 4 | |||
| Forward on voltage | VSD | 1.6 | V | ISD = 13 A, VGS = 0 V | 4 | ||
| Reverse recovery time | trr | 133 | ns | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V | 4 | ||
| Reverse recovery charge | Qrr | 651 | nC | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V | 4 | ||
| Reverse recovery current | IRRM | 10 | A | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V | 4 | ||
| Reverse recovery time (TJ = 150 °C) | trr | 157 | ns | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 | ||
| Reverse recovery charge (TJ = 150 °C) | Qrr | 895 | nC | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 | ||
| Reverse recovery current (TJ = 150 °C) | IRRM | 11 | A | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 | ||
| Gate-source voltage | VGS | -20 | 20 | V | 2 | ||
| Drain-source voltage | VDS | 250 | V | 2 | |||
| Drain current (continuous) | ID | 14 | A | TC = 25 °C | 2 | ||
| Drain current (continuous) | ID | 8.8 | A | TC = 100 °C | 2 | ||
| Drain current (pulsed) | IDM | 56 | A | Pulse width limited by safe operating area | 2 | ||
| Total power dissipation | PTOT | 85 | W | TC = 25 °C | 2 | ||
| Peak diode recovery voltage slope | dv/dt | 15 | V/ns | ISD ≤ 14 A, di/dt ≤ 300 A/µs, VDD = 80% V(BR)DSS | 2 | ||
| Storage temperature range | Tstg | -55 | 150 | °C | 2 | ||
| Avalanche current, repetitive or non-repetitive | IAR | 13 | A | Pulse width limited by TJ max. | 2 | ||
| Single pulse avalanche energy | EAS | 100 | mJ | Starting TJ = 25 °C, ID = IAR, VDD = 50 V | 2 | ||
| Thermal resistance, junction-to-case | RthJC | 1.47 | °C/W | 2 | |||
| Thermal resistance, junction-to-ambient | RthJA | 50 | °C/W | When mounted on 1 inch² FR-4, 2 Oz copper board | 2 |
CAD (KiCad official)
- Symbol:
STD16NF25 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2(DPAK) (KiCad packages3D, STEP)
- 3D model files:
std16nf25-etched.step/std16nf25-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);std16nf25.step/std16nf25.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (15 pp, sha256
6b4a565336ba37ba, retrieved 2026-09-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# STD16NF25
**STMicroelectronics** · MOSFETs · TO-252-2(DPAK)
STD16NF25 from STMicroelectronics, in a TO-252-2(DPAK). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate control input; VGS = ±20 V max, VGS(th) = 2-4 V at ID = 250 µA |
| 2 | Drain | passive | Drain terminal; VDS = 250 V max, ID = 14 A continuous at 25 °C, 8.8 A at 100 °C |
| 3 | Source | passive | Source terminal and reference return for the drain-source channel |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TO-252-2(DPAK) |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate threshold voltage | VGS(th) | 2 | 3 | 4 | V | VDS = VGS, ID = 250 µA | 3 |
| Static drain-source on resistance | RDS(on) | | 195 | 235 | mΩ | VGS = 10 V, ID = 6.5 A | 3 |
| Drain-source breakdown voltage | V(BR)DSS | 250 | | | V | VGS = 0 V, ID = 1 mA | 3 |
| Zero gate voltage drain current | IDSS | | | 1 | µA | VGS = 0 V, VDS = 250 V | 3 |
| Zero gate voltage drain current (TC = 125 °C) | IDSS | | | 10 | µA | VGS = 0 V, VDS = 250 V, TC = 125 °C | 3 |
| Gate-body leakage current | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ±20 V | 3 |
| Source-drain current | ISD | | | 14 | A | | 4 |
| Source-drain current (pulsed) | ISDM | | | 56 | A | | 4 |
| Forward on voltage | VSD | | | 1.6 | V | ISD = 13 A, VGS = 0 V | 4 |
| Reverse recovery time | trr | | | 133 | ns | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V | 4 |
| Reverse recovery charge | Qrr | | | 651 | nC | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V | 4 |
| Reverse recovery current | IRRM | | | 10 | A | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V | 4 |
| Reverse recovery time (TJ = 150 °C) | trr | | | 157 | ns | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 |
| Reverse recovery charge (TJ = 150 °C) | Qrr | | | 895 | nC | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 |
| Reverse recovery current (TJ = 150 °C) | IRRM | | | 11 | A | ISD = 13 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 |
| Gate-source voltage | VGS | -20 | | 20 | V | | 2 |
| Drain-source voltage | VDS | | | 250 | V | | 2 |
| Drain current (continuous) | ID | | | 14 | A | TC = 25 °C | 2 |
| Drain current (continuous) | ID | | | 8.8 | A | TC = 100 °C | 2 |
| Drain current (pulsed) | IDM | | | 56 | A | Pulse width limited by safe operating area | 2 |
| Total power dissipation | PTOT | | | 85 | W | TC = 25 °C | 2 |
| Peak diode recovery voltage slope | dv/dt | | | 15 | V/ns | ISD ≤ 14 A, di/dt ≤ 300 A/µs, VDD = 80% V(BR)DSS | 2 |
| Storage temperature range | Tstg | -55 | | 150 | °C | | 2 |
| Avalanche current, repetitive or non-repetitive | IAR | | | 13 | A | Pulse width limited by TJ max. | 2 |
| Single pulse avalanche energy | EAS | | | 100 | mJ | Starting TJ = 25 °C, ID = IAR, VDD = 50 V | 2 |
| Thermal resistance, junction-to-case | RthJC | | | 1.47 | °C/W | | 2 |
| Thermal resistance, junction-to-ambient | RthJA | | | 50 | °C/W | When mounted on 1 inch² FR-4, 2 Oz copper board | 2 |
## CAD (KiCad official)
- Symbol: `STD16NF25`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252-2(DPAK) (KiCad packages3D, STEP)
- 3D model files: `std16nf25-etched.step` / `std16nf25-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `std16nf25.step` / `std16nf25.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMicroelectronics datasheet](https://www.st.com/resource/en/datasheet/std16nf25.pdf) (15 pp, sha256 `6b4a565336ba37ba`, retrieved 2026-09-23, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/std16nf25-datasheet.pdf)