component
STD10NF10T4-HXY
Public Made by Adomby adom
HXY MOSFET MOSFETs, TO-252-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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STD10NF10T4-HXY
HXY MOSFET · MOSFETs · TO-252-2L
STD10NF10T4-HXY from HXY MOSFET, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate pin of the N-channel MOSFET, with gate-source voltage rated at ±20 V maximum and threshold of 1.0 to 2.5 V. |
| 2 | D | passive | Drain pin of the N-channel MOSFET, rated 100 V drain-source with 15 A continuous drain current at TC=25℃. |
| 3 | S | passive | Source pin of the N-channel MOSFET, with continuous body-diode source current of 12 A maximum. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-252-2L |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 100 | V | VGS=0V, ID=250uA | 2 | ||
| Static Drain-Source On-Resistance | RDS(ON) | 100 | 112 | mΩ | VGS=10V, ID=10A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 117 | 130 | mΩ | VGS=4.5V, ID=8A | 2 | |
| Gate Threshold Voltage | VGS(th) | 1 | 2.5 | V | VGS=VDS, ID=250uA | 2 | |
| Drain-Source Leakage Current | IDSS | 1 | uA | VDS=80V, VGS=0V, TJ=25℃ | 2 | ||
| Drain-Source Leakage Current | IDSS | 5 | uA | VDS=80V, VGS=0V, TJ=55℃ | 2 | ||
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| Continuous Source Current | IS | 12 | A | VG=VD=0V, Force Current | 2 | ||
| Pulsed Source Current | ISM | 24 | A | VG=VD=0V, Force Current | 2 | ||
| Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, IS=1A, TJ=25℃ | 2 | ||
| Drain-Source Voltage | VDS | 100 | V | TC=25℃ | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | TC=25℃ | 1 | |
| Continuous Drain Current | ID@TC=25℃ | 15 | A | VGS @ 10V | 1 | ||
| Continuous Drain Current | ID@TC=100℃ | 7.7 | A | VGS @ 10V | 1 | ||
| Pulsed Drain Current | IDM | 24 | A | TC=25℃ | 1 | ||
| Single Pulse Avalanche Energy | EAS | 6.1 | mJ | TC=25℃ | 1 | ||
| Avalanche Current | IAS | 11 | A | TC=25℃ | 1 | ||
| Total Power Dissipation | PD@TC=25℃ | 34.7 | W | TC=25℃ | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-ambient | RθJA | 62 | ℃/W | 1 | |||
| Thermal Resistance Junction-Case | RθJC | 3.6 | ℃/W | 1 | |||
| BVDSS Temperature Coefficient | △BVDSS/△TJ | 0.098 | V/℃ | Reference to 25℃, ID=1mA | 2 | ||
| VGS(th) Temperature Coefficient | △VGS(th) | -4.57 | mV/℃ | 2 | |||
| Forward Transconductance | gfs | 13 | S | VDS=5V, ID=10A | 2 | ||
| Gate Resistance | Rg | 2 | Ω | VDS=0V, VGS=0V, f=1MHz | 2 | ||
| Total Gate Charge (10V) | Qg | 26.2 | nC | VDS=80V, VGS=10V, ID=10A | 2 | ||
| Gate-Source Charge | Qgs | 4.6 | nC | VDS=80V, VGS=10V, ID=10A | 2 | ||
| Gate-Drain Charge | Qgd | 5.1 | nC | VDS=80V, VGS=10V, ID=10A | 2 | ||
| Turn-On Delay Time | Td(on) | 4.2 | ns | VDD=50V, VGS=10V, RG=3.3, ID=10A | 2 | ||
| Rise Time | Tr | 8.2 | ns | VDD=50V, VGS=10V, RG=3.3, ID=10A | 2 | ||
| Turn-Off Delay Time | Td(off) | 35.6 | ns | VDD=50V, VGS=10V, RG=3.3, ID=10A | 2 | ||
| Fall Time | Tf | 9.6 | ns | VDD=50V, VGS=10V, RG=3.3, ID=10A | 2 | ||
| Input Capacitance | Ciss | 1535 | pF | VDS=15V, VGS=0V, f=1MHz | 2 | ||
| Output Capacitance | Coss | 60 | pF | VDS=15V, VGS=0V, f=1MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 37 | pF | VDS=15V, VGS=0V, f=1MHz | 2 | ||
| Reverse Recovery Time | trr | 37 | nS | IF=10A, dI/dt=100A/µs, TJ=25℃ | 2 | ||
| Reverse Recovery Charge | Qrr | 27.3 | nC | IF=10A, dI/dt=100A/µs, TJ=25℃ | 2 |
CAD (KiCad official)
- Symbol:
STD10NF10T4-HXY - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2L (KiCad packages3D, STEP)
- 3D model files:
std10nf10t4-hxy-etched.step/std10nf10t4-hxy-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);std10nf10t4-hxy.step/std10nf10t4-hxy.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (6 pp, sha256
04e3fc0925b0e6a8, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# STD10NF10T4-HXY
**HXY MOSFET** · MOSFETs · TO-252-2L
STD10NF10T4-HXY from HXY MOSFET, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate pin of the N-channel MOSFET, with gate-source voltage rated at ±20 V maximum and threshold of 1.0 to 2.5 V. |
| 2 | D | passive | Drain pin of the N-channel MOSFET, rated 100 V drain-source with 15 A continuous drain current at TC=25℃. |
| 3 | S | passive | Source pin of the N-channel MOSFET, with continuous body-diode source current of 12 A maximum. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-252-2L |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 100 | | | V | VGS=0V, ID=250uA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 100 | 112 | mΩ | VGS=10V, ID=10A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 117 | 130 | mΩ | VGS=4.5V, ID=8A | 2 |
| Gate Threshold Voltage | VGS(th) | 1 | | 2.5 | V | VGS=VDS, ID=250uA | 2 |
| Drain-Source Leakage Current | IDSS | | | 1 | uA | VDS=80V, VGS=0V, TJ=25℃ | 2 |
| Drain-Source Leakage Current | IDSS | | | 5 | uA | VDS=80V, VGS=0V, TJ=55℃ | 2 |
| Gate-Source Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V, VDS=0V | 2 |
| Continuous Source Current | IS | | | 12 | A | VG=VD=0V, Force Current | 2 |
| Pulsed Source Current | ISM | | | 24 | A | VG=VD=0V, Force Current | 2 |
| Diode Forward Voltage | VSD | | | 1.2 | V | VGS=0V, IS=1A, TJ=25℃ | 2 |
| Drain-Source Voltage | VDS | | | 100 | V | TC=25℃ | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | TC=25℃ | 1 |
| Continuous Drain Current | ID@TC=25℃ | | | 15 | A | VGS @ 10V | 1 |
| Continuous Drain Current | ID@TC=100℃ | | | 7.7 | A | VGS @ 10V | 1 |
| Pulsed Drain Current | IDM | | | 24 | A | TC=25℃ | 1 |
| Single Pulse Avalanche Energy | EAS | | | 6.1 | mJ | TC=25℃ | 1 |
| Avalanche Current | IAS | | | 11 | A | TC=25℃ | 1 |
| Total Power Dissipation | PD@TC=25℃ | | | 34.7 | W | TC=25℃ | 1 |
| Storage Temperature Range | TSTG | -55 | | 150 | ℃ | | 1 |
| Operating Junction Temperature Range | TJ | -55 | | 150 | ℃ | | 1 |
| Thermal Resistance Junction-ambient | RθJA | | | 62 | ℃/W | | 1 |
| Thermal Resistance Junction-Case | RθJC | | | 3.6 | ℃/W | | 1 |
| BVDSS Temperature Coefficient | △BVDSS/△TJ | | 0.098 | | V/℃ | Reference to 25℃, ID=1mA | 2 |
| VGS(th) Temperature Coefficient | △VGS(th) | | -4.57 | | mV/℃ | | 2 |
| Forward Transconductance | gfs | | 13 | | S | VDS=5V, ID=10A | 2 |
| Gate Resistance | Rg | | 2 | | Ω | VDS=0V, VGS=0V, f=1MHz | 2 |
| Total Gate Charge (10V) | Qg | | 26.2 | | nC | VDS=80V, VGS=10V, ID=10A | 2 |
| Gate-Source Charge | Qgs | | 4.6 | | nC | VDS=80V, VGS=10V, ID=10A | 2 |
| Gate-Drain Charge | Qgd | | 5.1 | | nC | VDS=80V, VGS=10V, ID=10A | 2 |
| Turn-On Delay Time | Td(on) | | 4.2 | | ns | VDD=50V, VGS=10V, RG=3.3, ID=10A | 2 |
| Rise Time | Tr | | 8.2 | | ns | VDD=50V, VGS=10V, RG=3.3, ID=10A | 2 |
| Turn-Off Delay Time | Td(off) | | 35.6 | | ns | VDD=50V, VGS=10V, RG=3.3, ID=10A | 2 |
| Fall Time | Tf | | 9.6 | | ns | VDD=50V, VGS=10V, RG=3.3, ID=10A | 2 |
| Input Capacitance | Ciss | | 1535 | | pF | VDS=15V, VGS=0V, f=1MHz | 2 |
| Output Capacitance | Coss | | 60 | | pF | VDS=15V, VGS=0V, f=1MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 37 | | pF | VDS=15V, VGS=0V, f=1MHz | 2 |
| Reverse Recovery Time | trr | | 37 | | nS | IF=10A, dI/dt=100A/µs, TJ=25℃ | 2 |
| Reverse Recovery Charge | Qrr | | 27.3 | | nC | IF=10A, dI/dt=100A/µs, TJ=25℃ | 2 |
## CAD (KiCad official)
- Symbol: `STD10NF10T4-HXY`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252-2L (KiCad packages3D, STEP)
- 3D model files: `std10nf10t4-hxy-etched.step` / `std10nf10t4-hxy-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `std10nf10t4-hxy.step` / `std10nf10t4-hxy.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HXY MOSFET datasheet](docs/std10nf10t4-hxy-datasheet.pdf) (6 pp, sha256 `04e3fc0925b0e6a8`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/std10nf10t4-hxy-datasheet.pdf)