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Contents

README

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STB130N6F7

STMicroelectronics · MOSFETs · D2PAK

STB130N6F7 from STMicroelectronics, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the N-channel MOSFET; the gate-source voltage is rated at ±20 V (Table 2).
2 D passive Drain terminal of the MOSFET; drain-source voltage is rated at 60 V and continuous drain current at 80 A at Tcase = 25 °C, limited by the package.
3 S passive Source terminal of the MOSFET; the source-drain diode forward voltage is 1.2 V typical at VGS = 0 V and ISD = 80 A (Table 7).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package D2PAK
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 60 V 3
Gate-source voltage VGS -20 20 V 3
Drain current (continuous) ID 80 A Tcase = 25 °C; current limited by package 3
Drain current (pulsed) IDM 320 A Pulse width limited by safe operating area 3
Total dissipation PTOT 160 W Tcase = 25 °C 3
Single pulse avalanche energy EAS 200 mJ Starting Tj = 25 °C, ID = 20 A, VDD = 40 V 3
Storage temperature Tstg -55 175 °C 3
Thermal resistance junction-ambient Rthj-amb 35 °C/W Mounted on 1-inch² FR-4, 2 Oz copper board 3
Drain-source breakdown voltage V(BR)DSS 60 V VGS = 0 V, ID = 1 mA 4
Zero gate voltage drain current IDSS 1 µA VGS = 0 V, VDS = 60 V 4
Gate-body leakage current IGSS 100 nA VDS = 0 V, VGS = 20 V 4
Gate threshold voltage VGS(th) 2 4 V VDS = VGS, ID = 250 µA 4
Static drain-source on-resistance RDS(on) 4.2 5 mΩ VGS = 10 V, ID = 40 A 4
Thermal resistance junction-case Rthj-case 0.94 °C/W 3

CAD (KiCad official)

  • Symbol: STB130N6F7
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: D2PAK (KiCad packages3D, STEP)
  • 3D model files: stb130n6f7-etched.step / stb130n6f7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stb130n6f7.step / stb130n6f7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (14 pp, sha256 fac52b97cd192b65, retrieved 2026-10-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF