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Contents

README

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ST732M33R

STMicroelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5

ST732M33R from STMicroelectronics, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin; all datasheet voltage ratings are referred to GND.
2 VIN power_in Input voltage pin with an operating range of 2.5 V to 28 V and an absolute maximum DC input of -0.3 to 30 V.
3 VOUT power_out Regulated output voltage pin, which is 3.3 V for ST732M33R, with output current up to 300 mA.
4 NC unconnected Not internally connected.
5 NC unconnected Not internally connected.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC input voltage operating range VIN 2.5 28 V 6
Output voltage accuracy at TJ = 25 °C VOUT -1 1 % TJ = 25 °C 6
Output voltage accuracy over temperature VOUT -3 3 % -40 °C < TJ < +125 °C 6
Static line regulation ΔVOUT 0.01 0.05 %/V VIN = VOUT(NOM) + 1 V to 28 V 6
Dropout voltage VDROP 200 350 mV IOUT = 100 mA, VIN = VOUT(NOM) - 0.1 V 6
Dropout voltage VDROP 600 1200 mV IOUT = 300 mA, VIN = VOUT(NOM) - 0.1 V 6
Quiescent current IQ 5 10 µA IOUT = 0 mA 6
Quiescent current IQ 120 200 µA IOUT = 300 mA 6
Output noise voltage eN 70 µVRMS/VOUT f = 10 Hz to 100 kHz, IOUT = 10 mA COUT = 1 µF 6
Thermal shutdown TSHDN 160 °C 6
Thermal shutdown hysteresis 20 °C 6
DC input voltage absolute maximum VIN -0.3 30 V All values are referred to GND 5
DC output voltage absolute maximum VOUT -0.3 14 V All values are referred to GND 5
Storage temperature range TST -65 150 °C 5
Operating temperature range TOP -40 125 °C 5
Thermal resistance junction-ambient RthJA 190 °C/W 4-layer (2S2P) JEDEC test board per JESD 51-7 5
Thermal resistance junction-case RthJC 75 °C/W 5
Human body model ESD HBM -2 2 kV 5
Charged device model ESD CDM -500 500 V 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper PCB copper area through the package leads. The PCB copper area acts as a heat sink. The footprint copper 7

CAD (KiCad official)

  • Symbol: ST732M33R
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: st732m33r-etched.step / st732m33r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); st732m33r.step / st732m33r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (21 pp, sha256 f8cd0ca941e65a14, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF