# ST30100C

**SMC Sangdest Microelectronicstronic Nanjing** · Schottky Diodes · TO-220AB

ST30100C from SMC Sangdest Microelectronicstronic Nanjing, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of the first Schottky diode leg (15 A per leg average forward current, 100 V max reverse voltage). |
| 2 | CC | passive | Common cathode of both diode legs, also connected to the base/tab of the TO-220AB package. |
| 3 | A2 | passive | Anode of the second Schottky diode leg (15 A per leg average forward current, 100 V max reverse voltage). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SMC Sangdest Microelectronicstronic Nanjing |
| Package | TO-220AB |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage | VRRM |  |  | 100 | V |  | 1 |
| Working Peak Reverse Voltage | VRWM |  |  | 100 | V |  | 1 |
| DC Blocking Voltage | VR |  |  | 100 | V |  | 1 |
| Average Rectified Forward Current (Per Leg) | IF (AV) |  |  | 15 | A | 50% duty cycle @Tc=100°C, rectangular wave form | 1 |
| Average Rectified Forward Current (Per Device) | IF (AV) |  |  | 30 | A | 50% duty cycle @Tc=100°C, rectangular wave form | 1 |
| Peak One Cycle Non-Repetitive Surge Current (Per Leg) | IFSM |  |  | 200 | A | 8.3ms, Half Sine pulse | 1 |
| Forward Voltage Drop (Per Leg) | VF1 |  | 0.7 | 0.75 | V | @ 15A, Pulse, TJ = 25 C; Pulse width < 300 µs, duty cycle < 2% | 2 |
| Forward Voltage Drop (Per Leg) | VF2 |  | 0.66 | 0.68 | V | @ 15A, Pulse, TJ = 125 C; Pulse width < 300 µs, duty cycle < 2% | 2 |
| Reverse Current (Per Leg) | IR1 |  | 0.023 | 0.5 | mA | @VR = rated VR, TJ = 25 C; Pulse width < 300 µs, duty cycle < 2% | 2 |
| Reverse Current (Per Leg) | IR2 |  | 3.19 | 55 | mA | @VR = rated VR, TJ = 125 C; Pulse width < 300 µs, duty cycle < 2% | 2 |
| Junction Temperature | TJ | -55 |  | 150 | C |  | 2 |
| Storage Temperature | Tstg | -55 |  | 150 | C |  | 2 |
| Forward Voltage Drop (Per Leg) | VF1 |  | 0.5 |  | V | @ 5A, Pulse, TJ = 25 C; Pulse width < 300 µs, duty cycle < 2% | 2 |
| Forward Voltage Drop (Per Leg) | VF1 |  | 0.61 |  | V | @ 7.5A, Pulse, TJ = 25 C; Pulse width < 300 µs, duty cycle < 2% | 2 |
| Forward Voltage Drop (Per Leg) | VF2 |  | 0.46 |  | V | @ 5A, Pulse, TJ = 125 C; Pulse width < 300 µs, duty cycle < 2% | 2 |
| Forward Voltage Drop (Per Leg) | VF2 |  | 0.53 |  | V | @ 7.5A, Pulse, TJ = 125 C; Pulse width < 300 µs, duty cycle < 2% | 2 |
| Typical Thermal Resistance Junction to Case (Per Leg) | RθJC |  | 2.8 |  | C/W |  | 2 |

## CAD (KiCad official)

- Symbol: `ST30100C`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files: `st30100c-etched.step` / `st30100c-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `st30100c.step` / `st30100c.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SMC Sangdest Microelectronicstronic Nanjing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590234752440832000) (7 pp, sha256 `c7c8d7696715a77a`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/st30100c-datasheet.pdf)