component
ST25DV16KC-IE6T3
Public Made by Adomby adom
STMicroelectronics RFID ICs, TSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 2d ago |
| viewers | 2d ago |
| package.json | 2d ago |
| page.json | 2d ago |
| README.md | 2d ago |
| st25dv16kc-ie6t3-etched.glb | 2d ago |
| st25dv16kc-ie6t3-etched.step | 2d ago |
| st25dv16kc-ie6t3-hero.glb | 1d ago |
| st25dv16kc-ie6t3-hero.overlay.json | 2d ago |
| st25dv16kc-ie6t3.glb | 2d ago |
| st25dv16kc-ie6t3.kicad_mod | 2d ago |
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| st25dv16kc-ie6t3.lbr | 2d ago |
| st25dv16kc-ie6t3.step | 2d ago |
ST25DV16KC-IE6T3
STMicroelectronics · RFID ICs · TSSOP-8
ST25DV16KC-IE6T3 from STMicroelectronics, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | V_EH | power_out | Energy harvesting analog output that can be used to power external components. |
| 2 | AC0 | passive | Antenna coil connection AC0 for the RF interface; it forms the antenna pair with AC1. |
| 3 | AC1 | passive | Antenna coil connection AC1 for the RF interface; it forms the antenna pair with AC0. |
| 4 | VSS | power_in | Ground reference for the device. |
| 5 | SDA | bidirectional | I2C serial data input/output. |
| 6 | SCL | input | I2C serial clock input. |
| 7 | GPO | output | Interrupt output, open-drain on this package; it requires an external pull-up to recover the high level. |
| 8 | VCC | power_in | Supply voltage; the device operates from 1.8 V to 5.5 V according to the features list. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TSSOP-8 |
| Category | RF And Wireless |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
ST25DV16KC-IE6T3 - Footprint:
Package_SO:TSSOP-8_3x3mm_P0.65mm - 3D model: TSSOP-8 (KiCad packages3D, STEP)
- 3D model files:
st25dv16kc-ie6t3-etched.step/st25dv16kc-ie6t3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);st25dv16kc-ie6t3.step/st25dv16kc-ie6t3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (203 pp, sha256
aaa637577efb1a5d, retrieved 2026-10-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).