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Contents

README

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ST25DV04K-IER6S3

STMicroelectronics · RFID ICs · SOIC-8

ST25DV04K-IER6S3 from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 V_EH power_out Energy harvesting analog output pin; outputs rectified RF waveform voltage to power external components; internal voltage regulator supplies ST25DVxxx internal power from this node when operating contactlessly.
2 AC0 passive Antenna coil terminal 0; connects to external LC resonant antenna for ISO/IEC 15693 / NFC Forum Type 5 RF interface at 13.56 MHz; internal tuning capacitance of 28.5 pF.
3 AC1 passive Antenna coil terminal 1; connects to external LC resonant antenna for ISO/IEC 15693 / NFC Forum Type 5 RF interface at 13.56 MHz; internal tuning capacitance of 28.5 pF.
4 VSS power_in Ground reference for VCC and VDCG supply voltages and V_EH analog output voltage.
5 SDA bidirectional Bidirectional open-drain I2C serial data line; wire-OR compatible; requires external pull-up resistor to VCC; supports up to 1 MHz I2C protocol.
6 SCL input I2C serial clock input; strobes all data in and out of the ST25DVxxx; requires external pull-up resistor to VCC; supports up to 1 MHz.
7 GPO output Open-drain interrupt output (OD variant per MPN suffix I); configurable on multiple RF events including field change, memory write, activity, fast transfer mode end, and user set/reset/pulse.
8 VCC power_in Supply voltage input; 1.8 V to 5.5 V; internal voltage regulator allows VCC to supply ST25DVxxx internal supply when operating from I2C host.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOIC-8
Category RF And Wireless
Pins 8

CAD (KiCad official)

  • Symbol: ST25DV04K-IER6S3
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: st25dv04k-ier6s3-etched.step / st25dv04k-ier6s3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); st25dv04k-ier6s3.step / st25dv04k-ier6s3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (220 pp, sha256 a78032e05b89966b, retrieved 2026-09-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-sonnet-4-6 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF