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SST25VF512A-33-4I-SAE

Microchip Tech · NOR FLASH · SOIC-8

SST25VF512A-33-4I-SAE from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CE# input Chip Enable: the device is selected by a high-to-low transition on CE#, which must remain low for the duration of any command sequence.
2 SO output Serial Data Output: transfers data serially out of the device, shifted out on the falling edge of SCK.
3 WP# input Write Protect: enables or disables the BPL bit in the status register.
4 VSS power_in Ground reference for the device.
5 SI input Serial Data Input: transfers commands, addresses, or data serially into the device, latched on the rising edge of SCK.
6 SCK input Serial Clock: provides the timing of the serial interface, with commands, addresses, or input data latched on the rising edge and output data shifted out on the falling edge.
7 HOLD# input Hold: temporarily stops serial communication with the memory without resetting the device.
8 VDD power_in Power supply, 2.7-3.6V.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Read Current IDDR 10 mA CE#=0.1 VDD/0.9 VDD@20 MHz, SO=open 19
Program and Erase Current IDDW 30 mA CE#=VDD 19
Standby Current ISB 15 µA CE#=VDD,VIN=VDD or VSS 19
Input Leakage Current ILI 1 µA VIN=GND to VDD,VDD=VDD Max 19
Output Leakage Current ILO 1 µA VOUT=GND to VDD,VDD=VDD Max 19
Input Low Voltage VIL 0.8 V VDD=VDD Min 19
Output Low Voltage VOL 0.2 V IOL=100 µA, VDD=VDD Min 19
Supply Voltage (operating range) VDD 2.7 3.6 V Industrial range 19
Ambient Temperature (Industrial operating range) -40 85 °C Industrial range 19
Temperature Under Bias -55 125 °C 19
Storage Temperature -65 150 °C 19
DC Voltage on Any Pin to Ground Potential -0.5 V 19
Transient Voltage (<20 ns) on Any Pin to Ground Potential -2 V <20 ns 19
Package Power Dissipation Capability 1 W TA = 25°C 19
Surface Mount Solder Reflow Temperature 260 °C 10 seconds 19
Output Short Circuit Current 50 mA Output shorted for no more than one second. No more than one output shorted at a time. 19
Output Pin Capacitance COUT 12 pF VOUT = 0V 20
Input Capacitance CIN 6 pF VIN = 0V 20
Endurance NEND 10000 Cycles JEDEC Standard A117 20
Data Retention TDR 100 Years JEDEC Standard A103 20
VDD Min to Read Operation TPU-READ 10 µs 20
VDD Min to Write Operation TPU-WRITE 10 µs 20
Serial Clock Frequency FCLK 33 MHz 33 MHz column 21
Serial Clock High Time TSCKH 13 ns 33 MHz column 21
Serial Clock Low Time TSCKL 13 ns 33 MHz column 21
Serial Clock Rise Time (slew rate) TSCKR 0.1 V/ns 33 MHz column; may be limited by TSCKH and TSCKL 21
Serial Clock Fall Time (slew rate) TSCKF 0.1 V/ns 33 MHz column; may be limited by TSCKH and TSCKL 21
CE# Active Setup Time TCES 12 ns 33 MHz column; relative to SCK 21
CE# Active Hold Time TCEH 12 ns 33 MHz column; relative to SCK 21
CE# Not Active Setup Time TCHS 10 ns 33 MHz column 21
CE# Not Active Hold Time TCHH 10 ns 33 MHz column 21
CE# High Time TCPH 100 ns 33 MHz column 21
CE# High to High-Z Output TCHZ 14 ns 33 MHz column 21
SCK Low to Low-Z Output TCLZ 0 ns 33 MHz column 21
Data In Setup Time TDS 3 ns 33 MHz column 21
Data In Hold Time TDH 3 ns 33 MHz column 21
HOLD# Low Setup Time THLS 10 ns 33 MHz column 21
HOLD# High Setup Time THHS 10 ns 33 MHz column 21
HOLD# Low Hold Time THLH 10 ns 33 MHz column 21
HOLD# High Hold Time THHH 10 ns 33 MHz column 21
HOLD# Low to High-Z Output THZ 14 ns 33 MHz column 21
HOLD# High to Low-Z Output TLZ 14 ns 33 MHz column 21
Output Hold from SCK Change TOH 0 ns 33 MHz column 21
Output Valid from SCK TV 12 ns 33 MHz column 21
Sector-Erase TSE 25 ms 21
Block-Erase TBE 25 ms 21
Chip-Erase TSCE 100 ms 21
Byte-Program TBP 20 µs 21

CAD (KiCad official)

  • Symbol: SST25VF512A-33-4I-SAE
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: sst25vf512a-33-4i-sae-etched.step / sst25vf512a-33-4i-sae-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sst25vf512a-33-4i-sae.step / sst25vf512a-33-4i-sae.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (28 pp, sha256 f5630604f26960da, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF