component
SSP9452
Public Made by Adomby adom
Shanghai Siproin Microelectronics DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SSP9452
Shanghai Siproin Microelectronics · DC-DC Converters · ESOP-8
SSP9452 from Shanghai Siproin Microelectronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Input supply for all internal control circuits and the integrated switching MOSFET, with a 5V to 40V operating input range and a decoupling capacitor to ground required close to this pin. |
| 2 | NC | unconnected | No connection pin, as listed in the datasheet pin table. |
| 3 | EN | input | Enable input: pulling it below the threshold disables the chip (shutdown current under 2μA), while going above the 1.7V enable threshold (0.6V hysteresis) enables it, and a 100kΩ resistor to VIN allows automatic start-up. |
| 4 | FB | input | Feedback input to the error amplifier, where an external divider from the output to GND is compared to the internal 0.8V reference (Vfb 0.778V to 0.810V) to set the regulated output voltage. |
| 5 | NC | unconnected | No connection pin, as listed in the datasheet pin table. |
| 6 | GND | power_in | Ground, to be connected as close as possible to the output capacitor and kept away from high-current switching paths. |
| 7 | BST | passive | Bootstrap pin that supplies the floating high-side MOSFET driver, with a bypass capacitor connected between BST and SW (BST to SW absolute maximum -0.3V to 6.0V). |
| 8 | SW | output | Switch node output from the high-side switch, which requires a low-VF Schottky diode to ground close to this pin (SW absolute maximum -0.3V to VIN(MAX)+0.3V). |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Siproin Microelectronics |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Feedback Voltage | Vfb | 0.778 | 0.794 | 0.81 | V | 4 | |
| Oscillator Frequency | Fosc | 1.4 | 1.8 | 2.2 | MHz | 4 | |
| Supply Voltage (VIN) | VIN | -0.3 | 43 | V | 3 | ||
| BST to SW | VBST-VSW | -0.3 | 6 | V | 3 | ||
| All Other Pins | -0.3 | 6 | V | 3 | |||
| Switch Voltage (max: VIN(MAX)+0.3V) | VSW | -0.3 | V | 3 | |||
| Maximum Output Current | 1 | A | 3 | ||||
| Junction Temperature | 150 | ℃ | 3 | ||||
| Lead Temperature | 260 | ℃ | 3 | ||||
| Storage Temperature | -65 | 150 | ℃ | 3 | |||
| Operating Ambient Temperature | -40 | 85 | ℃ | 3 | |||
| Operating Junction Temperature | TJ | -40 | 125 | ℃ | 3 | ||
| Operating Input Voltage Range | VIN | 5 | 40 | V | 1 | ||
| Thermal Resistance Junction-to-Ambient | θJA | 50 | ℃/W | 3 | |||
| Thermal Resistance Junction-to-Case | θJC | 10 | ℃/W | 3 |
CAD (KiCad official)
- Symbol:
SSP9452 - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
ssp9452-etched.step/ssp9452-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ssp9452.step/ssp9452.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shanghai Siproin Microelectronics datasheet (13 pp, sha256
77c22cdbb619f656, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SSP9452
**Shanghai Siproin Microelectronics** · DC-DC Converters · ESOP-8
SSP9452 from Shanghai Siproin Microelectronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Input supply for all internal control circuits and the integrated switching MOSFET, with a 5V to 40V operating input range and a decoupling capacitor to ground required close to this pin. |
| 2 | NC | unconnected | No connection pin, as listed in the datasheet pin table. |
| 3 | EN | input | Enable input: pulling it below the threshold disables the chip (shutdown current under 2μA), while going above the 1.7V enable threshold (0.6V hysteresis) enables it, and a 100kΩ resistor to VIN allows automatic start-up. |
| 4 | FB | input | Feedback input to the error amplifier, where an external divider from the output to GND is compared to the internal 0.8V reference (Vfb 0.778V to 0.810V) to set the regulated output voltage. |
| 5 | NC | unconnected | No connection pin, as listed in the datasheet pin table. |
| 6 | GND | power_in | Ground, to be connected as close as possible to the output capacitor and kept away from high-current switching paths. |
| 7 | BST | passive | Bootstrap pin that supplies the floating high-side MOSFET driver, with a bypass capacitor connected between BST and SW (BST to SW absolute maximum -0.3V to 6.0V). |
| 8 | SW | output | Switch node output from the high-side switch, which requires a low-VF Schottky diode to ground close to this pin (SW absolute maximum -0.3V to VIN(MAX)+0.3V). |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Siproin Microelectronics |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Feedback Voltage | Vfb | 0.778 | 0.794 | 0.81 | V | | 4 |
| Oscillator Frequency | Fosc | 1.4 | 1.8 | 2.2 | MHz | | 4 |
| Supply Voltage (VIN) | VIN | -0.3 | | 43 | V | | 3 |
| BST to SW | VBST-VSW | -0.3 | | 6 | V | | 3 |
| All Other Pins | | -0.3 | | 6 | V | | 3 |
| Switch Voltage (max: VIN(MAX)+0.3V) | VSW | -0.3 | | | V | | 3 |
| Maximum Output Current | | | | 1 | A | | 3 |
| Junction Temperature | | | | 150 | ℃ | | 3 |
| Lead Temperature | | | | 260 | ℃ | | 3 |
| Storage Temperature | | -65 | | 150 | ℃ | | 3 |
| Operating Ambient Temperature | | -40 | | 85 | ℃ | | 3 |
| Operating Junction Temperature | TJ | -40 | | 125 | ℃ | | 3 |
| Operating Input Voltage Range | VIN | 5 | | 40 | V | | 1 |
| Thermal Resistance Junction-to-Ambient | θJA | | 50 | | ℃/W | | 3 |
| Thermal Resistance Junction-to-Case | θJC | | 10 | | ℃/W | | 3 |
## CAD (KiCad official)
- Symbol: `SSP9452`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `ssp9452-etched.step` / `ssp9452-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ssp9452.step` / `ssp9452.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Shanghai Siproin Microelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603010587060285440) (13 pp, sha256 `77c22cdbb619f656`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ssp9452-datasheet.pdf)