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SSP7786A-3.3V

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Shanghai Siproin Microelectronics SSP7786A 3 3V Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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SSP7786A-3.3V

Shanghai Siproin Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOP-8

SSP7786A-3.3V from Shanghai Siproin Microelectronics, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection. Leave floating or tie to a non-conductive net.
2 GND power_in Device ground reference.
3 VOUT power_out LDO regulated output voltage. Internally set to 3.3V (typ 3.3V, range 3.2-3.4V) for the -3.3V variant. Output current limit typ 138mA (100-160mA).
4 VDD power_in Voltage input supply used for energy storage. Connect a capacitor (Cvdd ≈ 0.01 × Iload, in Farads) between VDD and GND to store energy that feeds the LDO output stage. VDD_ON typ 7.8V, absolute max 9V.
5 Drain power_in Internal 650V power MOSFET drain. Connects to the rectified AC line to charge VDD during the AC-synchronous charging window (turn-on when Vdrain < 50V). Tie pins 5,6,7,8 together and maximize copper area for heat dissipation.
6 Drain power_in Internal 650V power MOSFET drain (parallel with pins 5, 7, 8). Provides energy to the backward stage when the input voltage drops into the charging window.
7 Drain power_in Internal 650V power MOSFET drain (parallel with pins 5, 6, 8).
8 Drain power_in Internal 650V power MOSFET drain (parallel with pins 5, 6, 7).

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOP-8
Category PMIC
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • SSP7786A-3.3V
  • SSP7786A-5V
  • SSP7786A-2.7V

CAD (KiCad official)

  • Symbol: SSP7786A-3.3V
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: ssp7786a-3-3v-etched.step / ssp7786a-3-3v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp7786a-3-3v.step / ssp7786a-3-3v.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
ssp7786a-3-3v.step 122 KB You want the bare part, or you mark your own boards.
ssp7786a-3-3v-etched.step 2.6 MB You want the part with SSP7786A-3.3V already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 629 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (10 pp, sha256 2afb02d06a43da06, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF