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SSP7615-30MR

Shanghai Siproin Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3

SSP7615-30MR from Shanghai Siproin Microelectronics, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin (GND) of the regulator, which the datasheet lists as the GND pin for the SOT23-3 package.
2 VOUT power_out Output voltage pin; the datasheet gives an output range of 1.2V~5.0V and a maximum output current of 400mA at VOUT=3.3V.
3 VIN power_in Input voltage pin; the input voltage range is 1.5V8V, and the absolute maximum VIN is -0.38V.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 1.5 8 V 5
Current Limit ILIMIT 400 mA VIN=VEN=4.5V 5
Short Current ISHORT 35 mA VEN=VIN, VOUT Short to GND with 1Ω 5
Line Regulation △VLINE 0.01 0.15 %/V VIN=2.7~5.5V, IOUT=1mA 5
Shut-down Current ISHDN 1 µA VEN=0V 5
EN logic high voltage VENH 1.2 V VIN=5.5V, IOUT=1mA 5
EN logic low voltage VENL 0.4 V VIN=5.5V, VOUT=0V 5
EN Input Current IEN 1 μA VEN= 0 to 5.5V 5
Input Voltage VIN -0.3 8 V 4
Max Output Current IOUT 450 mA 4
Operating Temperature Topr -40 85 ℃ 4
Storage Temperature Tstg -55 150 ℃ 4
Package Lead Soldering Temperature Tsol 260 ℃ 4
Junction Temperature Tj -40 125 ℃ 4
Thermal Resistance (Junction to Ambient) θJA 500 ℃/W SOT23-3, no ambient airflow, no heat sink 4
Power Dissipation PD 0.4 W SOT23-3, PD measured at Ta= 25℃ 4

CAD (KiCad official)

  • Symbol: SSP7615-30MR
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: ssp7615-30mr-etched.step / ssp7615-30mr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp7615-30mr.step / ssp7615-30mr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (13 pp, sha256 5ca4f994acdfaaba, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF