# SSP6206-18MR

**Shanghai Siproin Microelectronics** · Linear Voltage Regulators (LDO) · SOT-23

SSP6206-18MR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground (VSS) reference pin for the regulator, and the reference for the output voltage limit of VSS-0.3 V to VIN+0.3 V. |
| 2 | VOUT | power_out | Regulated 1.8 V output with ±2% accuracy, supplying up to 300 mA with foldback current limiting and a 1.0 uF ceramic output capacitor. |
| 3 | VIN | power_in | Input supply pin, rated 8 V absolute maximum with 6 V typical input voltage, decoupled with a 1.0 uF ceramic capacitor. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Siproin Microelectronics |
| Package | SOT-23 |
| Category | Power Management ICs |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage Accuracy |  | -2 |  | 2 | % |  | 1 |
| Line Regulation | △Vout1/(Vin·Vout) |  | 0.05 | 0.2 | %/V | 1.6V≤Vin≤8V; Iout=40mA | 4 |
| Load Regulation | △Vout/ΔIout |  | 12 | 30 | mV | Vin= Vout+1V; 1.0mA≤Iout≤80mA | 4 |
| Output voltage Temperature Coefficiency | △Vout/(Ta·Vout) | -100 |  | 100 | Ppm/℃ | Iout=30mA; 0℃≤Ta≤70℃ | 4 |
| Supply Current | Iss1 |  | 3.5 | 5 | uA |  | 4 |
| Input Voltage | Vin |  | 6 | 8 | V |  | 4 |
| Dropout Voltage | Vdif |  | 0.28 | 0.42 | V | 1.8 ≤ Vout ≤ 2; Iout=100 mA | 4 |
| Input Voltage (absolute maximum) | VIN |  |  | 8 | V |  | 3 |
| Output Current | IOUT |  |  | 300 | mA | *IOUT=Pd/(VIN-VOUT) | 3 |
| Power Dissipation (SOT23-3) | Pd |  |  | 0.25 | W | SOT23-3 package | 3 |
| Operating Temperature Range | Topr | -40 |  | 85 | ℃ |  | 3 |
| Storage Temperature Range | Tstg | -55 |  | 125 | ℃ |  | 3 |

## CAD (KiCad official)

- Symbol: `SSP6206-18MR`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `ssp6206-18mr-etched.step` / `ssp6206-18mr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ssp6206-18mr.step` / `ssp6206-18mr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shanghai Siproin Microelectronics datasheet](docs/ssp6206-18mr-datasheet.pdf) (7 pp, sha256 `6e7b0744a62c6f95`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ssp6206-18mr-datasheet.pdf)