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SSP6201P302PR

Shanghai Siproin Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3L

SSP6201P302PR from Shanghai Siproin Microelectronics, in a SOT-89-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulated 3.0V output (±2%) delivering 250mA typ. (500mA max.) with Vin-Vout=1V, with a 1uF tantalum or 6.8uF ceramic output capacitor recommended.
2 VSS power_in Ground pin of the regulator, connected to circuit ground.
3 VIN power_in Supply input rated up to 15V (absolute maximum, -0.3V minimum), with a 1uF input capacitor recommended.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-89-3L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy (tolerance) Vout -2 2 % Printed as tolerance ±2% in part number designator ③=2 (nominal Vout = 3.0V for this MPN); electrical table gives Vout×0.98 to Vout×1.02 for Vin=Vout+1V, 1.0mA≤Iout≤30mA 2
Output Current Iout 250 500 mA Vin-Vout=1V 4
Line Regulation 0.05 0.2 %/V 1.6V≤Vin≤8V, Iout=100mA 4
Load Regulation △Vout 12 30 mV Vin=Vout+1V, 1.0mA≤Iout≤100mA 4
Dropout Voltage Vdif 0.12 0.14 V 2.0 < Vout ≤ 3.0; Iout=80 mA (row applicable to 3.0V output) 4
Input Voltage Vin 15 V 4
Supply Voltage (absolute maximum) Vin -0.3 15 V 3
Output voltage temperature coefficient Ta VOUT -100 100 PPM/℃ Iout=30mA, 0℃≤Ta≤70℃; printed ±100 4
Operating Temperature -40 85 ℃ 3
Storage Temperature -40 125 ℃ 3
Power Supply Rejection Ratio PSRR 40 dB F=1KHz, Vin=Vout+1V 4
Supply Current Iss1 2 uA 4

CAD (KiCad official)

  • Symbol: SSP6201P302PR
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3L (KiCad packages3D, STEP)
  • 3D model files: ssp6201p302pr-etched.step / ssp6201p302pr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp6201p302pr.step / ssp6201p302pr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (6 pp, sha256 97da1122b84e3b71, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF