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SSP61CC2002MR

Shanghai Siproin Microelectronics · Supervisor And Reset ICs · SOT-23

SSP61CC2002MR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT output Detector output, either a CMOS inverter output (C-suffix parts such as SSP61CC2002MR) or an NMOS open-drain output, with output sink current IOL of at least 0.5 mA at VOUT = 0.2 V and VDD = 2 V.
2 GND power_in Ground connection for the voltage detector.
3 VIN power_in Supply voltage input with an absolute maximum range of -0.3 V to 8.0 V and an operating voltage range of 0.7 V to 10 V.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Voltage VDD 0.7 10 V 5
Supply Voltage Input (absolute maximum) VIN -0.3 8 V 5
Operating Temperature Tamb -30 80 ℃ 5
Storage Temperature Tstg -50 125 ℃ 5
Output Sink Current IOL 0.5 1 mA 2V VOUT=0.2V 5
Detection voltage accuracy (tolerance ±2%, order code digits 45 = 02) VDET -2 2 % 2
Temperature Coefficient of detection voltage -100 100 ppm/℃ -25℃<Ta<125℃ 5
Thermal Resistance (Junction to Ambient) θJA 250 ℃/W Assume no ambient airflow, no heat sink; package SOT23-3 5
Power Dissipation PD 0.2 W 5
Operating Current IDD 0.7 2.3 μA Vin=1.5V 5
Operating Current IDD 0.8 2.7 μA Vin=2.0V 5
Operating Current IDD 0.9 3 μA Vin=3.0V 5
Operating Current IDD 1 3.2 μA Vin=4.0V 5
Operating Current IDD 1.1 3.6 μA Vin=5.0V 5
Detection Voltage (nominal for this MPN) VDET 2 V VDF=0.8V~5.0V 5

CAD (KiCad official)

  • Symbol: SSP61CC2002MR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: ssp61cc2002mr-etched.step / ssp61cc2002mr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp61cc2002mr.step / ssp61cc2002mr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (10 pp, sha256 49887c43b8edefc9, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF