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SSP61CC1202MR

Public Made by Adom

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Shanghai Siproin Microelectronics Supervisor And Reset ICs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SSP61CC1202MR

Shanghai Siproin Microelectronics · Supervisor And Reset ICs · SOT-23

SSP61CC1202MR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT output Detector output; per the output table, VOUT is Hi-Z when VDD > VDET(+) and VSS when VDD ≤ VDET(-), with CMOS or N-channel open-drain output depending on the order code.
2 GND power_in Ground connection.
3 VIN power_in Supply voltage input; the electrical table gives an operating voltage of 0.7 V to 10 V, while the absolute maximum rating for VIN is -0.3 V to 8.0 V.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Input VIN -0.3 8 V 5
Operating Temperature Tamb -30 80 ℃ 5
Storage Temperature Tstg -50 125 ℃ 5
Operating Voltage VDD 0.7 10 V 5
Output Sink Current IOL 0.5 1 mA 2V VOUT=0.2V 5
Temperature Coefficient -100 100 ppm/℃ -25℃<Ta<125℃; printed as ±100 5
Detection Voltage accuracy (part-number code 02) VDET -2 2 % Accuracy code 02 = ±2% (SSP61CC1202MR) 2
Operating Current IDD 0.7 2.3 μA Vin=1.5V 5
Operating Current IDD 0.8 2.7 μA Vin=2.0V 5
Operating Current IDD 0.9 3 μA Vin=3.0V 5
Operating Current IDD 1 3.2 μA Vin=4.0V 5
Operating Current IDD 1.1 3.6 μA Vin=5.0V 5
Thermal Resistance (Junction to Ambient) θJA 250 ℃/W SOT23-3; assume no ambient airflow, no heat sink 5
Power Dissipation PD 0.2 W 5

CAD (KiCad official)

  • Symbol: SSP61CC1202MR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: ssp61cc1202mr-etched.step / ssp61cc1202mr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp61cc1202mr.step / ssp61cc1202mr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (10 pp, sha256 49887c43b8edefc9, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF