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docs ssp3485u: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
package.json Publish 0.2.0 · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json ssp3485u: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray
README.md ssp3485u: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray
ssp3485u-etched.fit.json ssp3485u: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
ssp3485u-etched.glb ssp3485u: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
ssp3485u-etched.step ssp3485u: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
ssp3485u.glb Publish 0.1.0 · Ray
ssp3485u.kicad_mod Publish 0.1.0 · Ray
ssp3485u.kicad_sym Publish 0.1.0 · Ray
ssp3485u.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
ssp3485u.step Publish 0.1.0 · Ray

SSP3485U

Shanghai Siproin Microelectronics · RS-485/RS-422 ICs · MSOP-8

SSP3485U from Shanghai Siproin Microelectronics, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output. Drives high when A-B >= -0.05V, low when A-B <= -0.2V, and high (fail-safe) when A and B are open or shorted. High-Z when the receiver is disabled (RE = H).
2 RE input Receiver output enable (active low). Receiver output RO is enabled when RE is low, and forced to high impedance when RE is high. Bar over 'RE' indicates active-low signalling.
3 DE input Driver output enable (active high). Bus drivers A and B are enabled when DE is high and forced to high impedance when DE is low. Pulling DE low together with RE high places the device in shutdown (ISHDN max 10 uA).
4 DI input Driver (transmit) data input. When DE is high, a low on DI forces A low and B high; a high on DI forces A high and B low. TTL/CMOS compatible (VIH >= 2.0V, VIL <= 0.8V).
5 GND power_in Device ground reference (0 V). All signal voltages are referenced to this pin.
6 A bidirectional Non-inverting RS-485/RS-422 differential bus line. Serves as receiver input and driver output. Withstands ±15kV HBM ESD and -13V to +13V common-mode range; 1/8 unit-load input (RIN >= 96 kOhm) permits up to 256 nodes on the bus.
7 B bidirectional Inverting RS-485/RS-422 differential bus line. Serves as receiver input and driver output. Withstands ±15kV HBM ESD and -13V to +13V common-mode range; 1/8 unit-load input (RIN >= 96 kOhm) permits up to 256 nodes on the bus.
8 VDD power_in +5 V supply input (operating range 4.75-5.25 V; abs max -0.3 to +7 V). Bypass with a 0.1 uF ceramic capacitor to GND close to the pin. Typical ICC 450 uA (max 1.1 mA); shutdown current 10 uA max.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package MSOP-8
Category Comm/UART
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • SSP3485UU
  • SSP3485U

CAD (KiCad official)

  • Symbol: SSP3485U
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: ssp3485u-etched.step / ssp3485u-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp3485u.step / ssp3485u.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
ssp3485u.step 123 KB You want the bare part, or you mark your own boards.
ssp3485u-etched.step 2.3 MB You want the part with SSP3485U already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 541 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (11 pp, sha256 746800f4846f9992, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF