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Contents

README

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SSP1839

Shanghai Siproin Microelectronics · Energy Metering · SOP-16

SSP1839 from Shanghai Siproin Microelectronics, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Power supply input, nominal 3.3V operation.
2 VT input External NTC temperature sensor analog signal input.
3 IP1 input Current channel A positive differential analog input, maximum ±50mV peak (35mV RMS).
4 IN1 input Current channel A negative differential analog input reference, maximum ±50mV peak (35mV RMS).
5 IP2 input Current channel B positive differential analog input, maximum ±50mV peak (35mV RMS).
6 IN2 input Current channel B negative differential analog input reference, maximum ±50mV peak (35mV RMS).
7 VP input Voltage channel differential analog input, maximum ±100mV peak (70mV RMS).
8 GND power_in Ground reference at 0V.
9 ZX output Voltage channel zero-crossing detection logic output.
10 I_leak output Channel B leakage/over-current alarm logic output.
11 CF output Energy pulse output or multiplex alarm function configurable via MODE register.
12 SEL input Interface selection input (0 = UART mode, 1 = SPI mode), internal pull-down to UART default.
13 SCLK input SPI serial clock input, maximum frequency 900 kHz, unused in UART mode.
14 RX/SDI input UART receive input (RX) at 4800 bps or SPI serial data input (SDI) in SPI mode.
15 TX/SDO output UART transmit output (TX) at 4800 bps or SPI serial data output (SDO), requires external pull-up resistor.
16 VPP unconnected Reserved pin, no connection required.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOP-16
Category Data Acquisition
Pins 16

CAD (KiCad official)

  • Symbol: SSP1839
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOP-16 (KiCad packages3D, STEP)
  • 3D model files: ssp1839-etched.step / ssp1839-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp1839.step / ssp1839.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (27 pp, sha256 8a58546aef68b8d7, retrieved 2026-09-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF