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Contents

README

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SSP1117-5.0V

Siproin's datasheet does not state the tab connection; this land follows the 1117-family convention (tab = Vout). Check before use.

Shanghai Siproin Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-223

SSP1117-5.0V from Shanghai Siproin Microelectronics, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ADJ/GND input Ground reference for the regulator. On fixed-voltage versions (including SSP1117-5.0V) pin 1 is the GND return; on the ADJ variant this same pin serves as the ADJ feedback node.
2 VOUT power_out Regulated 5.0V output (typ, ±2%). Delivers up to 1A load current. Requires a ~10uF tantalum output capacitor for stability.
3 VIN power_in Unregulated input supply. Recommended max 20V (absolute max 30V). For 5.0V output, Vin must exceed Vout by the dropout voltage (~1.3V at 1A). Recommended 10uF tantalum bypass capacitor to GND.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-223
Category PMIC
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage (SSP1117-5.0V) Vout 4.9 5 5.1 V 0≤Iout≤1A, Vin=7.0V 4
Line regulation (SSP1117-5.0V) △Vout 0.03 0.2 %/V Iout=10mA, 6.5V≤Vin≤12V 4
Load regulation (SSP1117-5.0V) △Vout 9 36 mV Vin=6.5V, 10mA≤Iout≤1A 5
Dropout voltage Vdrop 1.15 1.3 V Iout=100mA 5
Dropout voltage Vdrop 1.3 1.5 V Iout=1A 5
Quiescent current (SSP1117-5.0V) Iq 2 5 mA Vin=12V 5
Temperature coefficient ΔV/ΔT -100 100 ppm 5
Max input voltage 30 V 3
Max operating junction temperature Tj 150 ℃ 3
Ambient temperature Ta -40 85 ℃ 3
Storage temperature Ts -40 150 ℃ 3
Lead temperature 260 ℃ 10 s 3
Recommended maximum input voltage 20 V 3
Recommended operating junction temperature Tj -20 125 ℃ 3
Package thermal resistance (SOT-223) 20 ℃/W SOT-223 package 3

CAD (KiCad official)

  • Symbol: SSP1117-5.0V
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ssp1117-5-0v-etched.step / ssp1117-5-0v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp1117-5-0v.step / ssp1117-5-0v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (9 pp, sha256 4548d0eb79d83846, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF