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SSP1117-2.5V

Shanghai Siproin Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-223

SSP1117-2.5V from Shanghai Siproin Microelectronics, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin on the fixed 2.5V version (labelled ADJ/GND; it is the ADJ pin only on the adjustable version), returned to the input and output capacitor grounds.
2 VOUT power_out Regulated 2.5V output (2.45V to 2.55V for 0 to 1A load), with a recommended 10uF tantalum output capacitor for stability.
3 VIN power_in Input supply, recommended maximum 20V (absolute maximum 30V), with a recommended 10uF tantalum bypass capacitor.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-223
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage Vout 2.45 2.5 2.55 V 0≤Iout≤1A, Vin=4.5V 4
Quiescent current Iq 2 5 mA Vin=12V 5
Load regulation △Vout 4 16 mV Vin =4.0V, 10mA≤Iout≤1A 5
Line regulation △Vout 0.03 0.2 %/V Iout=10mA, 4.0V≤Vin≤12V 4
Dropout voltage Vdrop 1.15 1.3 V Iout =100mA 5
Dropout voltage Vdrop 1.3 1.5 V Iout=1A 5
Temperature coefficient ΔV/ΔT -100 100 ppm 5
Thermal resistance junction-to-case θJC 20 ℃/W SOT-223 5
Max input voltage 30 V 3
Max operating junction temperature Tj 150 ℃ 3
Ambient temperature Ta -40 85 ℃ 3
Storage temperature Ts -40 150 ℃ 3
Lead temperature 260 ℃ 10S 3
Recommended maximum input voltage 20 V 3
Recommended operating junction temperature Tj -20 125 ℃ 3
Package thermal resistance 20 ℃/W SOT-223 3

CAD (KiCad official)

  • Symbol: SSP1117-2.5V
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ssp1117-2-5v-etched.step / ssp1117-2-5v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp1117-2-5v.step / ssp1117-2-5v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (9 pp, sha256 4548d0eb79d83846, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF