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SSM3K09FU

TOSHIBA · MOSFETs · SOT-323

SSM3K09FU from TOSHIBA, in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V absolute maximum, with threshold Vth of 1.1 to 1.8 V at VDS = 5 V, ID = 0.1 mA.
2 S passive Source terminal of the N-channel MOSFET, the common reference for the gate drive.
3 D passive Drain; drain-source voltage is limited to 30 V and DC drain current to 400 mA (800 mA pulsed).

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package SOT-323
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate leakage current IGSS -1 1 μA VGS = ±16 V, VDS = 0 2
Drain-Source breakdown voltage V(BR)DSS 30 V ID = 1 mA, VGS = 0 2
Drain cut-off current IDSS 1 μA VDS = 30 V, VGS = 0 2
Gate threshold voltage Vth 1.1 1.8 V VDS = 5 V, ID = 0.1 mA 2
Forward transfer admittance ⏐Yfs⏐ 270 mS VDS = 5 V, ID = 200 mA (Note2: pulse test) 2
Drain-Source ON resistance RDS(ON) 0.5 0.7 Ω ID = 200 mA, VGS = 10 V (Note2: pulse test) 2
Drain-Source ON resistance RDS(ON) 0.8 1.2 Ω ID = 200 mA, VGS = 4 V (Note2: pulse test) 2
Drain-Source ON resistance RDS(ON) 1 1.7 Ω ID = 200 mA, VGS = 3.3 V (Note2: pulse test) 2
Drain-Source voltage VDS 30 V Ta = 25°C 1
Gate-Source voltage VGSS -20 20 V Ta = 25°C 1
Drain current DC ID 400 mA DC, Ta = 25°C 1
Drain current pulse IDP 800 mA Pulse, Ta = 25°C 1
Drain power dissipation PD 150 mW Ta = 25°C, Note 1: mounted on FR4 board (25.4 mm × 25.4 mm × 1.6 t, Cu pad 0.6 mm² × 3) 1
Channel temperature Tch 150 °C 1
Storage temperature Tstg -55 150 °C 1

CAD (KiCad official)

  • Symbol: SSM3K09FU
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323 (KiCad packages3D, STEP)
  • 3D model files: ssm3k09fu-etched.step / ssm3k09fu-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssm3k09fu.step / ssm3k09fu.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (5 pp, sha256 b87e1b68bb4bc41d, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF