component
SSA24
Public Made by Adomby adom
onsemi Schottky Barrier Diodes (SBD), SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSSA24
onsemi · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)
SSA24 from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal, marked by the color band on the SMA/DO-214AC package; SSA24 is rated for 40 V VRRM/VDC and 2 A average forward current. |
| 2 | Anode | passive | Anode terminal of the Schottky rectifier, opposite the color-band end of the SMA/DO-214AC package. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Recurrent Peak Reverse Voltage | VRRM | 40 | V | TA = 25°C | 2 | ||
| RMS Voltage | VRMS | 28 | V | TA = 25°C | 2 | ||
| DC Blocking Voltage | VDC | 40 | V | TA = 25°C | 2 | ||
| Average Forward Current | IF(AV) | 2 | A | TL = 75°C | 2 | ||
| Peak Forward Surge Current | IFSM | 50 | A | 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) | 2 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 2 | ||
| Forward Voltage | VF | 0.5 | V | IF = 2.0 A; pulse width 300 μs, 1% duty cycle | 3 | ||
| DC Reverse Current | IR | 0.2 | mA | VR = 40 V | 3 | ||
| DC Reverse Current | IR | 20 | mA | VR = 40 V, TA = 100°C | 3 | ||
| Typical Thermal Resistance, Junction-to-Ambient | RθJA | 75 | °C/W | Mounted on P.C. board with 8mm2 copper pad areas | 3 | ||
| Typical Thermal Characteristics, Junction-to-Lead | ψJL | 20 | °C/W | Mounted on P.C. board with 8mm2 copper pad areas | 3 | ||
| Reverse Recovery Time | Trr | 9.84 | ns | IF = 0.5 A, IR = 1 A, Irr = 0.25 A | 3 |
CAD (KiCad official)
- Symbol:
SSA24 - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
ssa24-etched.step/ssa24-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ssa24.step/ssa24.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (7 pp, sha256
2353da40cc23f3d4, retrieved 2026-10-24, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).