# SS58C

**Shandong Jingdao Microelectronics** · Schottky Barrier Diodes (SBD) · SMC

SS58C from Shandong Jingdao Microelectronics, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the Schottky rectifier; SS58C is rated 80V VRRM, 5.0A average forward current. |
| 2 | Anode | passive | Anode terminal of the Schottky rectifier; SS58C is rated 80V VRRM, 56V RMS, 5.0A average forward current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM |  |  | 80 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 56 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 80 | V |  | 1 |
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 5 | A |  | 1 |
| Max Instantaneous Forward Voltage | VF |  |  | 0.7 | V | at 5 A | 1 |
| Maximum DC Reverse Current | IR |  |  | 1 | mA | Ta = 25°C, at rated DC reverse voltage | 1 |
| Maximum DC Reverse Current | IR |  |  | 50 | mA | Ta = 100°C, at rated DC reverse voltage | 1 |
| Operating Junction Temperature Range | Tj | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 1 |
| Typical Junction Capacitance | Cj |  | 600 |  | pF | Measured at 1 MHz and applied reverse voltage of 4 V D.C | 1 |
| Typical Thermal Resistance | RθJA |  | 35 |  | °C/W | P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas | 1 |

## CAD (KiCad official)

- Symbol: `SS58C`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC (KiCad packages3D, STEP)
- 3D model files: `ss58c-etched.step` / `ss58c-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ss58c.step` / `ss58c.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shandong Jingdao Microelectronics datasheet](docs/ss58c-datasheet.pdf) (3 pp, sha256 `c85ddb55b68eddb6`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ss58c-datasheet.pdf)