component
SS3200C
Public Made by Adomby adom
MDD（Microdiode Electronics） Schottky Barrier Diodes (SBD), SMC(DO-214AB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSS3200C
MDD（Microdiode Electronics） · Schottky Barrier Diodes (SBD) · SMC(DO-214AB)
SS3200C from MDD（Microdiode Electronics）, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MDD（Microdiode Electronics） |
| Package | SMC(DO-214AB) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 200 | V | 1 | |||
| Maximum RMS voltage | VRMS | 140 | V | 1 | |||
| Maximum DC blocking voltage | VDC | 200 | V | 1 | |||
| Maximum average forward rectified current | I(AV) | 3 | A | 1 | |||
| Peak forward surge current | IFSM | 80 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 | ||
| Maximum instantaneous forward voltage | VF | 0.95 | V | at 3.0A | 1 | ||
| Maximum DC reverse current | IR | 0.3 | mA | TA=25℃ at rated DC blocking voltage | 1 | ||
| Maximum DC reverse current | IR | 3 | mA | TA=100℃ at rated DC blocking voltage | 1 | ||
| Typical junction capacitance | CJ | 350 | pF | Measured at 1MHz and applied reverse voltage of 4.0V D.C. | 1 | ||
| Typical thermal resistance | RJA | 50 | ℃/W | P.C.B. mounted with 2.0”x2.0”(5.0x5.0cm) copper pad areas | 1 | ||
| Operating junction temperature range | TJ | -55 | 150 | ℃ | 1 | ||
| Storage temperature range | TSTG | -55 | 150 | ℃ | 1 |
CAD (KiCad official)
- Symbol:
SS3200C - Footprint:
Diode_SMD:D_SMC - 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files:
ss3200c-etched.step/ss3200c-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ss3200c.step/ss3200c.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MDD（Microdiode Electronics） datasheet (3 pp, sha256
e448cb17e2c739fb, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).