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Contents

README

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SS315A

FUXINSEMI · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)

SS315A from FUXINSEMI, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode of the SS315A Schottky barrier rectifier, marked by the color band at the cathode end; the ratings table lists 150 V repetitive peak reverse voltage and 3.0 A average forward rectified current for this part.
2 Anode passive Anode of the SS315A Schottky barrier rectifier, where forward current enters the device; the part is rated for 3.0 A average forward rectified current and 80 A peak forward surge current (8.3 ms half sine-wave).

Key specifications

Parameter Value
Manufacturer FUXINSEMI
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 150 V 1
Maximum RMS voltage VRMS 105 V 1
Maximum DC blocking voltage VDC 150 V 1
Maximum average forward rectified current I(AV) 3 A at TL (see fig.1) 1
Peak forward surge current IFSM 80 A 8.3ms single half sine-wave superimposed on rated load 1
Maximum instantaneous forward voltage VF 0.95 V at 3.0A 1
Maximum DC reverse current IR 0.1 mA TA=25 C, at rated DC blocking voltage 1
Maximum DC reverse current IR 2 mA TA=100 C, at rated DC blocking voltage 1
Typical junction capacitance CJ 70 pF Measured at 1MHz and applied reverse voltage of 4.0V D.C. (NOTE 1) 1
Typical thermal resistance RθJA 70 C/W P.C.B. mounted with 2.0x2.0 in (5.0x5.0cm) copper pad areas (NOTE 2) 1
Operating junction temperature range TJ -55 150 C 1
Storage temperature range TSTG -55 150 C 1

CAD (KiCad official)

  • Symbol: SS315A
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: ss315a-etched.step / ss315a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ss315a.step / ss315a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUXINSEMI datasheet (4 pp, sha256 184e8982899a05d4, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF