component

SS26T3G

Public Made by Adom

by adom

onsemi Schottky Barrier Diodes (SBD), SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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SS26T3G

onsemi · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

SS26T3G from onsemi, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 60 V 1
Working Peak Reverse Voltage VRWM 60 V 1
DC Blocking Voltage VR 60 V 1
Average Rectified Forward Current IO 2 A At rated VR, TL = 95°C 1
Non-Repetitive Peak Surge Current IFSM 40 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 1
Storage/Operating Case Temperature Tstg, TC -55 150 °C 1
Operating Junction Temperature TJ -55 150 °C 1
Voltage Rate of Change dv/dt 10000 V/s Rated VR, TJ = 25°C 1
Maximum Instantaneous Forward Voltage vF 0.51 V iF = 1.0 A; TJ = 25°C 2
Maximum Instantaneous Forward Voltage vF 0.63 V iF = 2.0 A; TJ = 25°C 2
Maximum Instantaneous Forward Voltage vF 0.475 V iF = 1.0 A; TJ = 125°C 2
Maximum Instantaneous Forward Voltage vF 0.55 V iF = 2.0 A; TJ = 125°C 2
Maximum Instantaneous Reverse Current IR 0.2 mA VR = 60 V; TJ = 25°C 2
Maximum Instantaneous Reverse Current IR 20 mA VR = 60 V; TJ = 125°C 2
Thermal Resistance − Junction−to−Lead RJL 24 °C/W Mounted with minimum recommended pad size, PC Board FR4 (Note 1) 2
Thermal Resistance − Junction−to−Ambient RJA 80 °C/W 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board (Note 2) 2

CAD (KiCad official)

  • Symbol: SS26T3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: ss26t3g-etched.step / ss26t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ss26t3g.step / ss26t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 9b1200d3af55786c, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF