component
SS26SHE3_B
Public Made by Adomby adom
Vishay Intertech Schottky Barrier Diodes (SBD), SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SS26SHE3_B
Vishay Intertech · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)
SS26SHE3_B from Vishay Intertech, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the end marked by the color band on the DO-214AC (SMA) package. |
| 2 | A | passive | Anode, the end opposite the cathode color band on the DO-214AC (SMA) package. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum instantaneous forward voltage | VF | 0.6 | 0.75 | V | IF = 2.0 A, TA = 25 °C | 2 | |
| Maximum instantaneous forward voltage | VF | 0.53 | 0.62 | V | IF = 2.0 A, TA = 125 °C | 2 | |
| Maximum reverse current | IR | 200 | µA | Rated VR, TA = 25 °C | 2 | ||
| Maximum reverse current | IR | 1.5 | 10 | mA | Rated VR, TA = 125 °C | 2 | |
| Maximum repetitive peak reverse voltage | VRRM | 60 | V | TA = 25 °C | 1 | ||
| Maximum average forward rectified current | IF(AV) | 2 | A | TA = 25 °C | 1 | ||
| Peak forward surge current | IFSM | 40 | A | 8.3 ms single half sine-wave superimposed on rated load, TA = 25 °C | 1 | ||
| Operating junction temperature range | TJ, TSTG | -55 | 150 | °C | 1 | ||
| Instantaneous forward voltage | VF | 0.51 | V | IF = 1.0 A, TA = 25 °C | 2 | ||
| Instantaneous forward voltage | VF | 0.43 | V | IF = 1.0 A, TA = 125 °C | 2 | ||
| Typical thermal resistance, junction to ambient | RθJA | 100 | °C/W | PCB mounted with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas | 2 | ||
| Typical thermal resistance, junction to lead | RθJL | 28 | °C/W | PCB mounted with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
CAD (KiCad official)
- Symbol:
SS26SHE3_B - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
ss26she3-b-etched.step/ss26she3-b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ss26she3-b.step/ss26she3-b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (4 pp, sha256
2ba1b987b10f396d, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SS26SHE3_B
**Vishay Intertech** · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)
SS26SHE3_B from Vishay Intertech, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the end marked by the color band on the DO-214AC (SMA) package. |
| 2 | A | passive | Anode, the end opposite the cathode color band on the DO-214AC (SMA) package. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum instantaneous forward voltage | VF | | 0.6 | 0.75 | V | IF = 2.0 A, TA = 25 °C | 2 |
| Maximum instantaneous forward voltage | VF | | 0.53 | 0.62 | V | IF = 2.0 A, TA = 125 °C | 2 |
| Maximum reverse current | IR | | | 200 | µA | Rated VR, TA = 25 °C | 2 |
| Maximum reverse current | IR | | 1.5 | 10 | mA | Rated VR, TA = 125 °C | 2 |
| Maximum repetitive peak reverse voltage | VRRM | | | 60 | V | TA = 25 °C | 1 |
| Maximum average forward rectified current | IF(AV) | | | 2 | A | TA = 25 °C | 1 |
| Peak forward surge current | IFSM | | | 40 | A | 8.3 ms single half sine-wave superimposed on rated load, TA = 25 °C | 1 |
| Operating junction temperature range | TJ, TSTG | -55 | | 150 | °C | | 1 |
| Instantaneous forward voltage | VF | | 0.51 | | V | IF = 1.0 A, TA = 25 °C | 2 |
| Instantaneous forward voltage | VF | | 0.43 | | V | IF = 1.0 A, TA = 125 °C | 2 |
| Typical thermal resistance, junction to ambient | RθJA | | 100 | | °C/W | PCB mounted with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas | 2 |
| Typical thermal resistance, junction to lead | RθJL | | 28 | | °C/W | PCB mounted with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
## CAD (KiCad official)
- Symbol: `SS26SHE3_B`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files: `ss26she3-b-etched.step` / `ss26she3-b-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ss26she3-b.step` / `ss26she3-b.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Vishay Intertech datasheet](docs/ss26she3-b-datasheet.pdf) (4 pp, sha256 `2ba1b987b10f396d`, retrieved 2026-10-22, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ss26she3-b-datasheet.pdf)