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Contents

README

markdown

SS24T3G

onsemi · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

SS24T3G from onsemi, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Instantaneous Forward Voltage (SS24, 40 V part) vF 0.5 V iF = 2.0 A; TJ = 25°C 2
Maximum Instantaneous Forward Voltage (SS24, 40 V part) vF 0.46 V iF = 2.0 A; TJ = 125°C 2
Maximum Instantaneous Reverse Current (SS24, 40 V part) IR 0.4 mA VR = 40 V; TJ = 25°C 2
Maximum Instantaneous Reverse Current (SS24, 40 V part) IR 5.7 mA VR = 40 V; TJ = 100°C 2
Peak Repetitive Reverse Voltage (SS24) VRRM 40 V 2
Working Peak Reverse Voltage (SS24) VRWM 40 V 2
DC Blocking Voltage (SS24) VR 40 V 2
Average Rectified Forward Current IO 2 A At Rated VR, TL = 132°C 2
Peak Repetitive Forward Current IFRM 3 A At Rated VR, Square Wave, 100 kHz, TC = 127°C 2
Non-Repetitive Peak Surge Current IFSM 75 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 2
Storage/Operating Case Temperature Tstg, TC -55 150 °C 2
Operating Junction Temperature TJ -55 150 °C 2
Voltage Rate of Change dv/dt 10000 V/s Rated VR, TJ = 25°C 2
Thermal Resistance, Junction-to-Lead RθJL 24 °C/W Note 2: mounted with minimum recommended pad size, PC board FR4 2
Thermal Resistance, Junction-to-Ambient RθJA 80 °C/W Note 3: 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board 2

CAD (KiCad official)

  • Symbol: SS24T3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: ss24t3g-etched.step / ss24t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ss24t3g.step / ss24t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 59c9b5c914711a1f, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF