# SS210L

**Shandong Jingdao Microelectronics** · Schottky Diodes · SMA

SS210L from Shandong Jingdao Microelectronics, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the SS210L Schottky barrier rectifier, rated 100 V reverse voltage and 2.0 A forward current per the datasheet header. |
| 2 | Anode | passive | Anode terminal of the SS210L Schottky barrier rectifier, shown opposite the cathode (pin 1) in the simplified SMA outline and symbol. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | SMA |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM |  |  | 100 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 70 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 100 | V |  | 1 |
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 2 | A | P.C.B. mounted with 0.2" X 0.2" (5 X 5 mm) copper pad areas | 1 |
| Peak Forward Surge Current, 8.3ms single half sine-wave superimposed on rated load (JEDEC method) | IFSM |  |  | 50 | A | 8.3 ms single half sine-wave, JEDEC method | 1 |
| Max Instantaneous Forward Voltage | VF |  |  | 0.75 | V | at 2 A | 1 |
| I2t Rating for fusing | I2t |  |  | 10.3 | A2s | 3 ms ≤ t ≤ 8.3 ms | 1 |
| Operating Junction Temperature Range | Tj | -55 |  | 125 | °C |  | 1 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 1 |

## CAD (KiCad official)

- Symbol: `SS210L`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA (KiCad packages3D, STEP)
- 3D model files: `ss210l-etched.step` / `ss210l-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ss210l.step` / `ss210l.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shandong Jingdao Microelectronics datasheet](docs/ss210l-datasheet.pdf) (4 pp, sha256 `078c7a92b923853d`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ss210l-datasheet.pdf)