component

SS16T3G

Public Made by Adom

by adom

onsemi Schottky Barrier Diodes (SBD), SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SS16T3G

onsemi · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)

SS16T3G from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode lead, identified by the polarity band on the package; the device is rated for a peak repetitive reverse voltage (VRRM) of 60 V and an average rectified forward current (IO) of 1.0 A at TC = 105°C.
2 ANODE passive Anode lead of the Schottky rectifier, which carries the forward current from the anode to the cathode; the non-repetitive peak surge current (IFSM) is rated at 40 A.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 60 V 2
Working Peak Reverse Voltage VRWM 60 V 2
DC Blocking Voltage VR 60 V 2
Average Rectified Forward Current IO 1 A At rated VR, TC = 105°C 2
Non-Repetitive Peak Surge Current IFSM 40 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 2
Storage/Operating Case Temperature Tstg, TC -55 150 °C 2
Operating Junction Temperature TJ -55 150 °C 2
Voltage Rate of Change dv/dt 10000 V/s Rated VR, TJ = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.51 V IF = 0.1 A, TJ = 25°C; pulse width ≤ 250 s, duty cycle ≤ 2.0% 2
Maximum Instantaneous Forward Voltage VF 0.72 V IF = 1.0 A, TJ = 25°C; pulse width ≤ 250 s, duty cycle ≤ 2.0% 2
Maximum Instantaneous Reverse Current IR 0.2 mA VR = 60 V, TJ = 25°C 2
Maximum Instantaneous Reverse Current IR 5 mA VR = 60 V, TJ = 100°C 2
Thermal Resistance, Junction-to-Lead RJL 35 °C/W Mounted on 2 in square PC board with 1 in square total pad size, PC board FR4 (Note 1) 2
Thermal Resistance, Junction-to-Ambient RJA 86 °C/W Mounted on 2 in square PC board with 1 in square total pad size, PC board FR4 (Note 1) 2

CAD (KiCad official)

  • Symbol: SS16T3G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: ss16t3g-etched.step / ss16t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ss16t3g.step / ss16t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 e16fcf936dd5c003, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF