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Ray Publish 0.1.0 4fa6d1e 5h ago

SS12-E3

Vishay Intertech · Schottky Barrier Diodes (SBD) · DO-214AC

SS12-E3 from Vishay Intertech, in a DO-214AC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package DO-214AC
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum instantaneous forward voltage VF 0.5 V 1.0 A, pulse test 300 µs pulse width, 1% duty cycle (SS12 column) 2
Maximum DC reverse current at rated DC blocking voltage, TA = 25 °C IR 0.2 mA TA = 25 °C, at rated DC blocking voltage, pulse test pulse width ≤ 40 ms 2
Maximum DC reverse current at rated DC blocking voltage, TA = 100 °C IR 6 mA TA = 100 °C, at rated DC blocking voltage, pulse test pulse width ≤ 40 ms 2
Maximum repetitive peak reverse voltage VRRM 20 V 1
Maximum RMS voltage VRMS 14 V 1
Maximum DC blocking voltage VDC 20 V 1
Maximum average forward rectified current IF(AV) 1 A at TL (fig. 1) 1
Peak forward surge current IFSM 40 A 8.3 ms single half sine-wave superimposed on rated load 1
Voltage rate of change (rated VR) dV/dt 10000 V/μs rated VR 1
Operating junction temperature range TJ -65 150 °C 1
Storage temperature range TSTG -65 150 °C 1
Typical thermal resistance, junction to ambient RθJA 88 °C/W PCB mounted with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas 2
Typical thermal resistance, junction to lead RθJL 28 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 1

CAD (KiCad official)

  • Symbol: SS12-E3
  • Footprint: Diode_SMD:D_SMA
  • 3D model: DO-214AC (KiCad packages3D, STEP)
  • 3D model files: ss12-e3-etched.step / ss12-e3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ss12-e3.step / ss12-e3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (4 pp, sha256 84f451af1ad4a0cb, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF