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README

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SQ4961EY-T1_GE3

Vishay Intertech · MOSFETs · SO-8

SQ4961EY-T1_GE3 from Vishay Intertech, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of P-channel MOSFET 1, with drain-source voltage rated -60 V and continuous source current (diode conduction) of -3 A.
2 G1 input Gate of P-channel MOSFET 1, with gate-source voltage rated ±20 V and threshold VGS(th) of -1.5 V min, -2.0 V typ, -2.5 V max at ID = -250 µA.
3 S2 passive Source of P-channel MOSFET 2, with drain-source voltage rated -60 V and continuous source current (diode conduction) of -3 A.
4 G2 input Gate of P-channel MOSFET 2, with gate-source voltage rated ±20 V and threshold VGS(th) of -1.5 V min, -2.0 V typ, -2.5 V max at ID = -250 µA.
5 D2 passive Drain of P-channel MOSFET 2, with continuous drain current of -4.4 A per leg at TC = 25 °C and pulsed drain current of -18 A.
6 D2 passive Drain of P-channel MOSFET 2 (second drain pin, tied to pin 5), with continuous drain current of -4.4 A per leg at TC = 25 °C and RDS(on) of 0.085 Ω max at VGS = -10 V.
7 D1 passive Drain of P-channel MOSFET 1, with continuous drain current of -4.4 A per leg at TC = 25 °C and pulsed drain current of -18 A.
8 D1 passive Drain of P-channel MOSFET 1 (second drain pin, tied to pin 7), with continuous drain current of -4.4 A per leg at TC = 25 °C and RDS(on) of 0.085 Ω max at VGS = -10 V.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SO-8
Category Triode/MOS Tube/Transistor
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -60 V TC = 25 °C 1
Gate-Source Voltage VGS -20 20 V TC = 25 °C 1
Continuous Drain Current ID -4.4 A TC = 25 °C 1
Continuous Drain Current ID -2.5 A TC = 125 °C 1
Continuous Source Current (Diode Conduction) IS -3 A 1
Pulsed Drain Current IDM -18 A 1
Single Pulse Avalanche Current IAS -20 A L = 0.1 mH 1
Single Pulse Avalanche Energy EAS 20 mJ L = 0.1 mH 1
Maximum Power Dissipation PD 3.3 W TC = 25 °C 1
Maximum Power Dissipation PD 1.1 W TC = 125 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 175 °C 1
Junction-to-Ambient Thermal Resistance RthJA 105 °C/W PCB mount 1
Junction-to-Foot (Drain) Thermal Resistance RthJF 45 °C/W 1
Drain-Source Breakdown Voltage VDS -60 V VGS = 0 V, ID = - 250 μA 2
Gate-Source Threshold Voltage VGS(th) -1.5 -2 -2.5 V VDS = VGS, ID = - 250 μA 2
Gate-Source Leakage IGSS 100 nA VDS = 0 V, VGS = ± 20 V 2
Zero Gate Voltage Drain Current IDSS -1 μA VGS = 0 V, VDS = - 60 V 2
Zero Gate Voltage Drain Current IDSS -50 μA VGS = 0 V, VDS = - 60 V, TJ = 125 °C 2
Zero Gate Voltage Drain Current IDSS -150 μA VGS = 0 V, VDS = - 60 V, TJ = 175 °C 2
On-State Drain Current ID(on) -12 A VGS = - 10 V, VDS ≤ - 5 V 2
Drain-Source On-State Resistance RDS(on) 0.07 0.085 Ω VGS = - 10 V, ID = - 3.5 A 2
Drain-Source On-State Resistance RDS(on) 0.142 Ω VGS = - 10 V, ID = - 3.5 A, TJ = 125 °C 2
Drain-Source On-State Resistance RDS(on) 0.176 Ω VGS = - 10 V, ID = - 3.5 A, TJ = 175 °C 2
Drain-Source On-State Resistance RDS(on) 0.095 0.115 Ω VGS = - 4.5 V, ID = - 2.5 A 2
Input Capacitance Ciss 912 1140 pF VGS = 0 V, VDS = - 30 V, f = 1 MHz 2
Output Capacitance Coss 100 125 pF VGS = 0 V, VDS = - 30 V, f = 1 MHz 2
Reverse Transfer Capacitance Crss 60 75 pF VGS = 0 V, VDS = - 30 V, f = 1 MHz 2
Total Gate Charge Qg 26.5 40 nC VGS = - 10 V, VDS = - 30 V, ID = - 4.3 A 2
Gate Resistance Rg 3 16 Ω f = 1 MHz 2
Turn-On Delay Time td(on) 11 17 ns VDD = - 30 V, RL = 8.8 Ω, VGEN = - 10 V, Rg = 1 Ω 2
Rise Time tr 13 20 ns VDD = - 30 V, RL = 8.8 Ω, VGEN = - 10 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 36 54 ns VDD = - 30 V, RL = 8.8 Ω, VGEN = - 10 V, Rg = 1 Ω 2
Fall Time tf 8 12 ns VDD = - 30 V, RL = 8.8 Ω, VGEN = - 10 V, Rg = 1 Ω 2
Pulsed Source Current ISM -18 A 2
Forward Voltage VSD -0.84 -1.2 V IF = - 3 A, VGS = 0 V 2
Forward Transconductance gfs 9 S VDS = - 15 V, ID = - 3.5 A 2
Gate-Source Charge Qgs 3.8 nC VGS = - 10 V, VDS = - 30 V, ID = - 4.3 A 2
Gate-Drain Charge Qgd 5.8 nC VGS = - 10 V, VDS = - 30 V, ID = - 4.3 A 2

CAD (KiCad official)

  • Symbol: SQ4961EY-T1_GE3
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: sq4961ey-t1-ge3-etched.step / sq4961ey-t1-ge3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sq4961ey-t1-ge3.step / sq4961ey-t1-ge3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (9 pp, sha256 97172bd948d8f3bc, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF