component
SPZT2907AT1G
Public Made by Adomby adom
onsemi Bipolar Transistors - BJT, SOT-223-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSPZT2907AT1G
onsemi · Bipolar Transistors - BJT · SOT-223-4
SPZT2907AT1G from onsemi, in a SOT-223-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BASE | passive | Base terminal of the PNP epitaxial transistor; the datasheet gives emitter-base breakdown V(BR)EBO of −5.0 Vdc minimum and a maximum emitter-base rating VEBO of −5.0 Vdc. |
| 2 | COLLECTOR | passive | Collector terminal (electrically tied to pin 4 and the tab); the datasheet rates collector-emitter voltage VCEO at −60 Vdc and continuous collector current IC at −600 mAdc. |
| 3 | EMITTER | passive | Emitter terminal of the PNP transistor; the emitter-base rating is VEBO −5.0 Vdc. |
| 4 | COLLECTOR | passive | Collector terminal (electrically tied to pin 2 and the tab); the datasheet rates collector-emitter voltage VCEO at −60 Vdc and continuous collector current IC at −600 mAdc. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-223-4 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector−Base Breakdown Voltage | V(BR)CBO | -60 | Vdc | IC = −10 Adc, IE = 0 | 2 | ||
| Collector−Emitter Breakdown Voltage | V(BR)CEO | -60 | Vdc | IC = 10 mAdc, IB = 0 | 2 | ||
| Emitter−Base Breakdown Voltage | V(BR)EBO | -5 | Vdc | IE = −10 Adc, IC = 0 | 2 | ||
| Collector−Base Cutoff Current | ICBO | -10 | nAdc | VCB = −50 Vdc, IE = 0 | 2 | ||
| Collector−Emitter Cutoff Current | ICEX | -50 | nAdc | VCE = −30 Vdc, VBE = 0.5 Vdc | 2 | ||
| Base−Emitter Cutoff Current | IBEX | -50 | nAdc | VCE = −30 Vdc, VBE = −0.5 Vdc | 2 | ||
| DC Current Gain | hFE | 75 | IC = −0.1 mAdc, VCE = −10 Vdc | 2 | |||
| DC Current Gain | hFE | 100 | IC = −1.0 mAdc, VCE = −10 Vdc | 2 | |||
| DC Current Gain | hFE | 50 | IC = −500 mAdc, VCE = −10 Vdc | 2 | |||
| DC Current Gain (upper limit, condition not identifiable in text) | hFE | 300 | 2 | ||||
| Collector-Emitter Saturation Voltage | VCE(sat) | -0.4 | Vdc | IC = −150 mAdc, IB = −15 mAdc | 2 | ||
| Collector-Emitter Saturation Voltage | VCE(sat) | -1.6 | Vdc | IC = − 500 mAdc, IB = −50 mAdc | 2 | ||
| Base-Emitter Saturation Voltage | VBE(sat) | -1.3 | Vdc | IC = −150 mAdc, IB = −15 mAdc | 2 | ||
| Base-Emitter Saturation Voltage | VBE(sat) | -2.6 | Vdc | IC = −500 mAdc, IB = −50 mAdc | 2 | ||
| Current-Gain − Bandwidth Product | fT | 200 | MHz | IC = −50 mAdc, VCE = −20 Vdc, f = 100 MHz | 2 | ||
| Output Capacitance | Cc | 8 | pF | VCB = −10 Vdc, IE = 0, f = 1.0 MHz | 2 | ||
| Input Capacitance | Ce | 30 | pF | VEB = −2.0 Vdc, IC = 0, f = 1.0 MHz | 2 | ||
| Turn-On Time | ton | 45 | ns | VCC = −30 Vdc, IC = −150 mAdc, IB1 = −15 mAdc | 2 | ||
| Delay Time | td | 10 | ns | VCC = −30 Vdc, IC = −150 mAdc, IB1 = −15 mAdc | 2 | ||
| Rise Time | tr | 40 | ns | VCC = −30 Vdc, IC = −150 mAdc, IB1 = −15 mAdc | 2 | ||
| Turn-Off Time | toff | 100 | ns | VCC = −6.0 Vdc, IC = −150 mAdc, IB1 = IB2 = −15 mAdc | 2 | ||
| Storage Time | ts | 80 | ns | VCC = −6.0 Vdc, IC = −150 mAdc, IB1 = IB2 = −15 mAdc | 2 | ||
| Fall Time | tf | 30 | ns | VCC = −6.0 Vdc, IC = −150 mAdc, IB1 = IB2 = −15 mAdc | 2 | ||
| Collector−Emitter Voltage | VCEO | -60 | Vdc | 1 | |||
| Collector−Base Voltage | VCBO | -60 | Vdc | 1 | |||
| Emitter−Base Voltage | VEBO | -5 | Vdc | 1 | |||
| Collector Current − Continuous | IC | -600 | mAdc | 1 | |||
| Total Device Dissipation | PD | 1.5 | W | TA = 25°C (Note 1: FR−4 with 1 oz and 713 mm2 of copper area) | 1 | ||
| Thermal Resistance Junction−to−Ambient | RJA | 83.3 | °C/W | Note 1: FR−4 with 1 oz and 713 mm2 of copper area | 1 | ||
| Lead Temperature for Soldering | TL | 260 | °C | 0.0625″ from case; time in solder bath 10 s | 1 | ||
| Operating and Storage Temperature Range | TJ, Tstg | -65 | 150 | °C | 1 |
CAD (KiCad official)
- Symbol:
SPZT2907AT1G - Footprint:
Package_TO_SOT_SMD:SOT-223 - 3D model: SOT-223-4 (KiCad packages3D, STEP)
- 3D model files:
spzt2907at1g-etched.step/spzt2907at1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);spzt2907at1g.step/spzt2907at1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (6 pp, sha256
23c2234b4fbb24f7, retrieved 2026-10-26, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).