component
SPU09P06PL-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, TO-251. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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SPU09P06PL-VB
VBsemi Elec · MOSFETs · TO-251
SPU09P06PL-VB from VBsemi Elec, in a TO-251. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; gate-source voltage is limited to ±20 V per the absolute maximum ratings. |
| 2 | D | passive | Drain terminal; drain-source voltage is -60 V and continuous drain current is -20 A at TC = 25 °C. |
| 3 | S | passive | Source terminal; continuous source-drain diode current is -66 A at TC = 25 °C per the body diode characteristics. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-251 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -60 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current TC=25 °C | ID | -20 | A | TJ = 150 °C, TC = 25 °C | 1 | ||
| Continuous Drain Current TC=70 °C | ID | -16 | A | TJ = 150 °C, TC = 70 °C | 1 | ||
| Pulsed Drain Current | IDM | -100 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 101 | mJ | L = 0.1 mH | 1 | ||
| Maximum Power Dissipation TC=25 °C | PD | 35 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation TC=70 °C | PD | 20 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation TA=25 °C | PD | 3 | W | TA = 25 °C | 1 | ||
| Maximum Power Dissipation TA=70 °C | PD | 2 | W | TA = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient Steady State | RthJA | 33 | 40 | °C/W | Steady State | 1 | |
| Maximum Junction-to-Case Steady State | RthJC | 0.98 | 1.2 | °C/W | Steady State | 1 | |
| Drain-Source Breakdown Voltage | VDS | -60 | V | VGS = 0 V, ID = -250 µA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | -1 | -2.5 | V | VDS = VGS, ID = -250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = -60 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current TJ=55 °C | IDSS | -10 | µA | VDS = -60 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | -120 | A | VDS = -5 V, VGS = -10 V | 2 | ||
| Drain-Source On-State Resistance VGS=-10 V | RDS(on) | 0.066 | Ω | VGS = -10 V, ID = -30 A | 2 | ||
| Drain-Source On-State Resistance VGS=-4.5 V | RDS(on) | 0.08 | Ω | VGS = -4.5 V, ID = -20 A | 2 | ||
| Forward Transconductance | gfs | 20 | S | VDS = -15 V, ID = -50 A | 2 | ||
| Input Capacitance | Ciss | 1200 | pF | VDS = -25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 200 | pF | VDS = -25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 150 | pF | VDS = -25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Total Gate Charge | Qg | 40 | nC | VDS = -30 V, VGS = -10 V, ID = -55 A | 2 | ||
| Total Gate Charge VGS=-4.5 V | Qg | 38 | nC | VDS = -30 V, VGS = -4.5 V, ID = -55 A | 2 | ||
| Gate-Source Charge | Qgs | 16 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 19 | nC | 2 | |||
| Gate Resistance | Rg | 5.2 | Ω | f = 1 MHz | 2 | ||
| Turn-On Delay Time | td(on) | 10 | 15 | ns | VDD = - 2 V, RL = 2, ID - 10 A, VGEN = - 10 V, Rg = 1 | 2 | |
| Rise Time | tr | 7 | 15 | ns | VDD = - 2 V, RL = 2, ID - 10 A, VGEN = - 10 V, Rg = 1 | 2 | |
| Turn-Off Delay Time | td(off) | 70 | 110 | ns | VDD = - 2 V, RL = 2, ID - 10 A, VGEN = - 10 V, Rg = 1 | 2 | |
| Fall Time | tf | 40 | 60 | ns | VDD = - 2 V, RL = 2, ID - 10 A, VGEN = - 10 V, Rg = 1 | 2 | |
| Continuous Source-Drain Diode Current | IS | -66 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | -150 | A | 2 | |||
| Body Diode Voltage | VSD | -1 | -1.5 | V | IS = -30 A | 2 | |
| Body Diode Reverse Recovery Time | trr | 45 | 68 | ns | IF = -50 A, di/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 59 | 120 | nC | IF = -50 A, di/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Reverse Recovery Fall Time | ta | 29 | ns | 2 | |||
| Reverse Recovery Rise Time | tb | 16 | ns | 2 | |||
| VDS Temperature Coefficient | VDS/TJ | 68 | mV/°C | ID = -250 µA | 2 | ||
| VGS(th) Temperature Coefficient | VGS(th)/TJ | -5.2 | mV/°C | 2 |
CAD (KiCad official)
- Symbol:
SPU09P06PL-VB - Footprint:
Package_TO_SOT_THT:TO-251-3_Vertical - 3D model: TO-251 (KiCad packages3D, STEP)
- 3D model files:
spu09p06pl-vb-etched.step/spu09p06pl-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);spu09p06pl-vb.step/spu09p06pl-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
50d197a985f493b7, retrieved 2026-10-26, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).