component
SPP80P06PHXKSA1
Public Made by Adomby adom
Infineon Technologies MOSFETs, TO-220-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 9d ago |
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| page.json | 9d ago |
| README.md | 9d ago |
| spp80p06phxksa1-etched.glb | 9d ago |
| spp80p06phxksa1-etched.step | 9d ago |
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| spp80p06phxksa1-hero.overlay.json | 9d ago |
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SPP80P06PHXKSA1
Infineon Technologies · MOSFETs · TO-220-3
SPP80P06PHXKSA1 from Infineon Technologies, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate, with a gate-source voltage limit of ±20 V and a gate threshold VGS(th) of -2.1 to -4 V (-3 V typ) at ID = -5.5 mA. |
| 2 | D | passive | Drain, connected to the mounting tab; rated for VDS = -60 V and continuous drain current ID = -80 A at TC = 25 °C (current limited by bondwire). |
| 3 | S | passive | Source, the reference terminal for the ±20 V gate-source rating and the reverse-diode forward voltage VSD of -1.2 V (typ) to -1.6 V (max) at IF = -80 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-220-3 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous drain current | ID | -80 | A | TC = 25 °C | 1 | ||
| Continuous drain current | ID | -64 | A | TC = 100 °C | 1 | ||
| Pulsed drain current | ID puls | -320 | A | TC = 25 °C | 1 | ||
| Avalanche energy, single pulse | EAS | 823 | mJ | ID = -80 A, VDD = -25 V, RGS = 25 Ω | 1 | ||
| Avalanche energy, periodic limited by Tjmax | EAR | 34 | periodic limited by Tjmax | 1 | |||
| Reverse diode dv/dt | dv/dt | 6 | kV/µs | IS = -80 A, VDS = -48, di/dt = 200 A/µs, Tjmax = 175 °C | 1 | ||
| Gate source voltage | VGS | -20 | 20 | V | 1 | ||
| Power dissipation | Ptot | 340 | W | TC = 25 °C | 1 | ||
| Operating and storage temperature | Tj, Tstg | -55 | 175 | °C | 1 | ||
| Thermal resistance, junction - case | RthJC | 0.4 | K/W | 2 | |||
| Thermal resistance, junction - ambient, leaded | RthJA | 62 | K/W | leaded | 2 | ||
| Thermal resistance, junction - ambient, SMD version | RthJA | 62 | K/W | SMD version, device on PCB, @ min. footprint | 2 | ||
| Thermal resistance, junction - ambient, SMD version | RthJA | 40 | K/W | SMD version, device on PCB, @ 6 cm2 cooling area | 2 | ||
| Drain-source breakdown voltage | V(BR)DSS | -60 | V | VGS = 0 V, ID = -250 µA | 2 | ||
| Gate threshold voltage | VGS(th) | -2.1 | -3 | -4 | V | ID = -5.5 mA, VGS = VDS | 2 |
| Zero gate voltage drain current | IDSS | -0.1 | -1 | µA | VDS = -60 V, VGS = 0 V, Tj = 25 °C | 2 | |
| Zero gate voltage drain current | IDSS | -10 | -100 | µA | VDS = -60 V, VGS = 0 V, Tj = 150 °C | 2 | |
| Gate-source leakage current | IGSS | -10 | -100 | nA | VGS = -20 V, VDS = 0 V | 2 | |
| Drain-source on-state resistance | RDS(on) | 0.021 | 0.023 | Ω | VGS = -10 V, ID = -64 A | 2 | |
| Transconductance | gfs | 18 | 36 | S | VDS ≥ 2IDRDS(on)max, ID = -64 A | 3 | |
| Input capacitance | Ciss | 4026 | 5033 | pF | VGS = 0 V, VDS = -25 V, f = 1 MHz | 3 | |
| Output capacitance | Coss | 1252 | 1565 | pF | VGS = 0 V, VDS = -25 V, f = 1 MHz | 3 | |
| Reverse transfer capacitance | Crss | 437 | 546 | pF | VGS = 0 V, VDS = -25 V, f = 1 MHz | 3 | |
| Turn-on delay time | td(on) | 24 | 36 | ns | VDD = -30 V, VGS = -10 V, ID = -64 A, RG = 1 Ω | 3 | |
| Rise time | tr | 18 | 27 | ns | VDD = -30 V, VGS = -10 V, ID = -64 A, RG = 1 Ω | 3 | |
| Turn-off delay time | td(off) | 56 | 84 | ns | VDD = -30 V, VGS = -10 V, ID = -64 A, RG = 1 Ω | 3 | |
| Fall time | tf | 30 | 45 | ns | VDD = -30 V, VGS = -10 V, ID = -64 A, RG = 1 Ω | 3 | |
| Gate to source charge | Qgs | 27.4 | 41 | nC | VDD = -48 V, ID = -80 A | 4 | |
| Gate to drain charge | Qgd | 50 | 75 | nC | VDD = -48 V, ID = -80 A | 4 | |
| Gate charge total | Qg | 115 | 173 | nC | VDD = -48 V, ID = -80 A, VGS = 0 to -10 V | 4 | |
| Inverse diode continuous forward current | IS | -80 | A | TC = 25 °C | 4 | ||
| Inverse diode direct current, pulsed | ISM | -320 | A | TC = 25 °C | 4 | ||
| Inverse diode forward voltage | VSD | -1.2 | -1.6 | V | VGS = 0 V, IF = -80 A | 4 | |
| Reverse recovery time | trr | 117 | 175 | ns | VR = -30 V, IF = IS, diF/dt = 100 A/µs | 4 | |
| Reverse recovery charge | Qrr | 420 | 630 | nC | VR = -30 V, IF = IS, diF/dt = 100 A/µs | 4 | |
| Gate plateau voltage | V(plateau) | -6.2 | V | VDD = -48 V, ID = -80 A | 4 |
CAD (KiCad official)
- Symbol:
SPP80P06PHXKSA1 - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220-3 (KiCad packages3D, STEP)
- 3D model files:
spp80p06phxksa1-etched.step/spp80p06phxksa1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);spp80p06phxksa1.step/spp80p06phxksa1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (11 pp, sha256
12948bfdd99dcecf, retrieved 2026-10-29, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).