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Contents

README

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SPD91011W-2

WILLSEMI Will Semicon · ESD And Surge Protection (TVS/ESD) · SOD-323

SPD91011W-2 from WILLSEMI Will Semicon, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive Bi-directional TVS line terminal (stand-off voltage ±3.3V max, 1.5pF typ. capacitance); connects to the protected line, interchangeable with pin 2.
2 Pin2 passive Bi-directional TVS line terminal (stand-off voltage ±3.3V max, 1.5pF typ. capacitance); connects to the protected line or ground, interchangeable with pin 1.

Key specifications

Parameter Value
Manufacturer WILLSEMI Will Semicon
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse maximum working voltage VRWM -3.3 3.3 V 2
Reverse leakage current IR 100 nA VRWM = 3.3V 2
Reverse breakdown voltage VBR 3.5 V IT = 1mA 2
Clamping voltage (TLP) VCL 9.5 V IPP = 16A, tp = 100ns 2
Dynamic resistance RDYN 0.35 Ω 2
Clamping voltage (ESD contact) VCL 10 V VESD = 8kV 2
Clamping voltage (surge) VCL 6 V IPP = 1A, tp = 8/20μs 2
Clamping voltage (surge) VCL 10 V IPP = 10A, tp = 8/20μs 2
Clamping voltage (surge) VCL 16 V IPP = 25A, tp = 8/20μs 2
Junction capacitance CJ 1.5 2 pF VR = 0V, f = 1MHz 2
Peak pulse power Ppk 350 W tp = 8/20μs 2
Peak pulse current IPP 25 A tp = 8/20μs 2
ESD air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Junction temperature TJ 125 °C 2
Operating temperature TOP -40 85 °C 2
Lead temperature TL 260 °C 2
Storage temperature TSTG -55 150 °C 2

CAD (KiCad official)

  • Symbol: SPD91011W-2
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: spd91011w-2-etched.step / spd91011w-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); spd91011w-2.step / spd91011w-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI Will Semicon datasheet (6 pp, sha256 aa0e03882f08b577, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF